
MCP604 Series
Manufacturer: Microchip Technology
OPERATIONAL AMPLIFIER, QUAD, 2.8 MHZ, 4, 2.3 V/ S, 2.7V TO 5.5V, DIP, 14 ROHS COMPLIANT: YES
| Part | Number of Circuits | Package Length | Package Name | Package Width | Output Type | Current - Supply | Gain Bandwidth Product | Current - Output / Channel | Amplifier Type | Voltage - Supply Span (Max) | Operating Temperature (Max) | Operating Temperature (Min) | Slew Rate | Voltage - Input Offset | Voltage - Supply Span (Min) | Mounting Type | Current - Input Bias |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 4 | 0.3 in | 14-DIP 14-PDIP | 7.62 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 85 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Through Hole | 1 pA |
Microchip Technology | 4 | 0.173 in | 14-TSSOP | 4.4 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 85 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |
Microchip Technology | 4 | 0.173 in | 14-TSSOP | 4.4 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 125 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |
Microchip Technology | 4 | 0.154 in | 14-SOIC | 3.9 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 125 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |
Microchip Technology | 4 | 0.154 in | 14-SOIC | 3.9 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 125 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |
Microchip Technology | 4 | 0.173 in | 14-TSSOP | 4.4 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 125 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |
Microchip Technology | 4 | 0.3 in | 14-DIP 14-PDIP | 7.62 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 125 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Through Hole | 1 pA |
Microchip Technology | 4 | 0.154 in | 14-SOIC | 3.9 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 85 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |
Microchip Technology | 4 | 0.173 in | 14-TSSOP | 4.4 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 125 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |
Microchip Technology | 4 | 0.173 in | 14-TSSOP | 4.4 mm | Rail-to-Rail | 230 µA | 2.8 MHz | 22 mA | CMOS | 6 V | 85 °C | -40 °C | 2.3 V/Ąs | 700 µV | 2.7 V | Surface Mount | 1 pA |