13-0518 Series

Catalog

13P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Current Rating (Amps)	Termination	Mounting Type	Pitch - Post	Pitch - Post	Type	Contact Material - Mating	Number of Positions or Pins (Grid)	Material Flammability Rating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish - Mating	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Features	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 13-0518-10H	3 A	Solder	Through Hole	2.54 mm	0.1 in	SIP	Beryllium Copper	13	UL94 V-0	Tin	200 µin	5.08 µm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame
Aries Electronics 13-0518-00	3 A	Solder	Surface Mount	2.54 mm	0.1 in	SIP	Beryllium Copper	13	UL94 V-0	Tin	200 µin	5.08 µm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Brass			0.1 in	2.54 mm	Open Frame	0.046 in	1.17 mm
Aries Electronics 13-0518-10	3 A	Solder	Through Hole	2.54 mm	0.1 in	SIP	Beryllium Copper	13	UL94 V-0	Tin	200 µin	5.08 µm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame
Aries Electronics 13-0518-11	3 A	Solder	Through Hole	2.54 mm	0.1 in	SIP	Beryllium Copper	13	UL94 V-0	Gold	10 çin	0.25 çm	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Open Frame