CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Type | Type | Type | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Current Rating (Amps) | Contact Material - Post | Contact Finish - Post | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Housing Material | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Material - Mating | Mounting Type | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3575-10 | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Solder | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Closed Frame | 1 A | Beryllium Copper | Tin | 48 | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 2.54 mm | 0.1 in | Beryllium Copper | Through Hole | 0.11 in | 2.78 mm |
Aries Electronics 48-3575-16 | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Solder | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Closed Frame | 1 A | Beryllium Copper | Tin | 48 | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 2.54 mm | 0.1 in | Beryllium Copper | Through Hole | 0.11 in | 2.78 mm |
Aries Electronics 48-3575-11 | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | Solder | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Closed Frame | 1 A | Beryllium Copper | Tin | 48 | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 2.54 mm | 0.1 in | Beryllium Copper | Through Hole | 0.11 in | 2.78 mm |