48-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Material Flammability Rating	Termination Post Length	Current Rating	Contact Material - Mating	Row Spacing	Type	Termination	Housing Material	Contact Finish Thickness - Post	Contact Material - Post	Mounting Type	Contact Finish Thickness - Mating	Contact Finish - Mating	Features	Pitch - Post	Pitch - Mating	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Contact Finish - Post
Aries Electronics 48-3575-10	UL94 V-0	0.11 in	1 A	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Glass Filled Polyphenylene Sulfide PPS	200 µin	Beryllium Copper	Through Hole	200 Ąin	Tin	Closed Frame	0.1 in	0.1 in	48	24	2	Tin
Aries Electronics 48-3575-11	UL94 V-0	0.11 in	1 A	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Glass Filled Polyphenylene Sulfide PPS	200 µin	Beryllium Copper	Through Hole	200 Ąin	Tin	Closed Frame	0.1 in	0.1 in	48	24	2	Tin