CONN IC DIP SOCKET 32POS GOLD
| Part | Termination | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Features | Housing Material | Mounting Type | Material Flammability Rating | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Solder | Brass | Flash | Gold | 125 °C | -65 ░C | 2 x 16 | 32 | 1 A | Open Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | UL94 V-0 | 2.54 mm | 0.1 in | DIP | 0.6 in | 15.24 mm | Beryllium Copper | 0.203 Ám | 8 Áin | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | Gold | |
Solder | Brass | Flash | Gold | 125 °C | -65 ░C | 2 x 16 | 32 | 1 A | Closed Frame, Seal Tape | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | UL94 V-0 | 2.54 mm | 0.1 in | DIP | 0.6 in | 15.24 mm | Beryllium Copper | 0.203 Ám | 8 Áin | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | Gold | |
Solder | Brass | Flash | Gold | 125 °C | -65 ░C | 2 x 16 | 32 | 1 A | Open Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | UL94 V-0 | 2.54 mm | 0.1 in | DIP | 0.6 in | 15.24 mm | Beryllium Copper | 0.203 Ám | 8 Áin | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | Gold |