36-6554 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS
| Part | Material Flammability Rating | Current Rating | Termination Post Length | Row Spacing | Type | Housing Material | Mounting Type | Contact Material - Post | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Features | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Grid Rows | Grid Columns | Number of Positions or Pins (Grid) | Termination | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | Glass Filled PEEK Polyetheretherketone | Through Hole | Beryllium Nickel | 0.1 in | 50 µin | Boron Nickel | 250 °C | -55 °C | Closed Frame | 50 µin | Beryllium Nickel | 0.1 in | 2 | 18 | 36 | Solder | Nickel Boron |
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 0.6 in | 0.6" (15.24mm) Row Spacing DIP ZIF (ZIP) | Glass Filled Polyphenylene Sulfide PPS | Through Hole | Beryllium Copper | 0.1 in | 50 µin | Boron Nickel | Closed Frame | 50 µin | Beryllium Copper | 0.1 in | 2 | 18 | 36 | Solder | Nickel Boron |