36-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Current Rating (Amps)	Features	Termination	Mounting Type	Pitch - Post	Pitch - Post	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Type	Type	Type
Aries Electronics 36-6554-18	1.27 µm	50 µin	Beryllium Nickel	1 A	Closed Frame	Solder	Through Hole	2.54 mm	0.1 in	Polyetheretherketone (PEEK) Glass Filled	-55 °C	250 °C	Beryllium Nickel	36	Nickel Boron	0.11 in	2.78 mm	Nickel Boron	1.27 µm	50 µin	UL94 V-0	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 36-6554-16	1.27 µm	50 µin	Beryllium Copper	1 A	Closed Frame	Solder	Through Hole	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled			Beryllium Copper	36	Nickel Boron	0.11 in	2.78 mm	Nickel Boron	1.27 µm	50 µin	UL94 V-0	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "