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CONN IC DIP SOCKET 18POS GOLD
| Part | Features | Material Flammability Rating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Type | Type | Type | Contact Material - Post [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Housing Material | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame Elevated | UL94 V-0 | 18 | 3 A | Gold | 0.1 in | 2.54 mm | Gold | 0.3 " | 7.62 mm | DIP | Brass | 105 ░C | -55 °C | Beryllium Copper | Solder | 10 çin | 0.25 çm | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám | 3.56 mm | 0.14 in |
Aries Electronics | Closed Frame Elevated | UL94 V-0 | 18 | 3 A | Gold | 0.1 in | 2.54 mm | Gold | 0.6 in | 15.24 mm | DIP | Brass | 105 ░C | -55 °C | Beryllium Copper | Solder | 10 çin | 0.25 çm | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám | 3.56 mm | 0.14 in |