40-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS

Part	Contact Material - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Contact Finish - Post	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Material - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Material Flammability Rating	Features	Type	Type	Type	Mounting Type
Aries Electronics 40-6554-18	Beryllium Nickel	Nickel Boron	1.27 µm	50 µin	-55 °C	250 °C	Solder	Nickel Boron	2.54 mm	0.1 in	0.11 in	2.78 mm	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	1 A	0.1 in	2.54 mm	Beryllium Nickel	40	20	2	UL94 V-0	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Through Hole
Aries Electronics 40-6554-16	Beryllium Copper	Nickel Boron	1.27 µm	50 µin			Solder	Nickel Boron	2.54 mm	0.1 in	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	1 A	0.1 in	2.54 mm	Beryllium Copper	40	20	2	UL94 V-0	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Through Hole
Aries Electronics 40-6554-11	Beryllium Copper	Gold					Solder	Gold	2.54 mm	0.1 in	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled			1 A	0.1 in	2.54 mm	Beryllium Copper	40	20	2	UL94 V-0	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Through Hole