40-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS

Part	Housing Material	Features	Contact Material - Post	Termination	Pitch - Mating	Contact Finish Thickness - Post	Contact Material - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish - Mating	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish - Post	Row Spacing	Type	Mounting Type	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Termination Post Length	Current Rating	Material Flammability Rating
Aries Electronics 40-6554-18	Glass Filled PEEK Polyetheretherketone	Closed Frame	Beryllium Nickel	Solder	0.1 in	50 µin	Beryllium Nickel	250 °C	-55 °C	Boron Nickel	0.1 in	50 µin	Nickel Boron	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	20	40	2	0.11 in	1 A	UL94 V-0
Aries Electronics 40-6554-10	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	Beryllium Copper	Solder	0.1 in	200 µin	Beryllium Copper			Tin	0.1 in	200 Ąin	Tin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	20	40	2	0.11 in	1 A	UL94 V-0
Aries Electronics 40-6554-16	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	Beryllium Copper	Solder	0.1 in	50 µin	Beryllium Copper			Boron Nickel	0.1 in	50 µin	Nickel Boron	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	20	40	2	0.11 in	1 A	UL94 V-0
Aries Electronics 40-6554-11	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	Beryllium Copper	Solder	0.1 in		Beryllium Copper			Gold	0.1 in		Gold	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	20	40	2	0.11 in	1 A	UL94 V-0