214 Series
Manufacturer: 3M Electronic Specialty
Beta
⌘K
CONN IC DIP SOCKET ZIF 14POS GLD
| Part | Contact Material - Post | Operating Temperature (Max) | Operating Temperature (Min) | Contact Material - Mating | Housing Material | Row Spacing | Type | Pitch - Post | Contact Finish Thickness - Post | Mounting Type | Number of Positions or Pins (Grid) | Grid Columns | Grid Rows | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Termination | Contact Finish - Post | Features | Contact Resistance | Material Flammability Rating | Termination Post Length | Current Rating | Shelf Life | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Shelf Life Start | Color | Thickness | Tape Type | Adhesive | Carrier | Backing | Usage | Length (ft) | Length (yd) | Temperature Range (Single) | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 3M Electronic Specialty | Beryllium Copper | 125 °C | -55 °C | Beryllium Copper | Glass Filled Polysulfone PSU | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | 30 µin | Connector | 14 | 7 | 2 | 0.1 in | 30 µin | Gold | Press-Fit | Gold | Closed Frame | 25 mOhm | UL94 V-0 | 0.11 in | 1 A | |||||||||||||||
 3M Electronic Specialty | 12 Months | 80 °F | 60 °F | Date of Manufacture | Tan | 0.0067 in | Masking | Rubber | Crepe Paper | Crepe Paper | High Temperature Adhesion | 180 ft | 60 yd | 350 °F | 2 in | |||||||||||||||||||||||
 3M Electronic Specialty | Beryllium Copper | 150 °C | -55 °C | Beryllium Copper | Glass Filled PES Polyethersulfone | SOIC | 30 µin | Through Hole | 14 | 7 | 2 | Gold | Solder | Gold | Closed Frame | UL94 V-0 | 0.14 in | 1 A |