SF-1206SA500W-2
ActiveBourns Inc.
FUSE CHIP SLOW BLOW ACTING 5A 32V SMD SOLDER PAD 3.2 X 1.6 X 1.08MM T/R AUTOMOTIVE AEC-Q200
SF-1206SA500W-2
ActiveBourns Inc.
FUSE CHIP SLOW BLOW ACTING 5A 32V SMD SOLDER PAD 3.2 X 1.6 X 1.08MM T/R AUTOMOTIVE AEC-Q200
Description
General part information
SF-1206SA500W-2
FUSE CHIP SLOW BLOW ACTING 5A 32V SMD SOLDER PAD 3.2 X 1.6 X 1.08MM T/R AUTOMOTIVE AEC-Q200
Technical Specifications
Parameters and characteristics for this part
| Specification | SF-1206SA500W-2 |
|---|---|
| Approval Agency | cUL, UL |
| Breaking Capacity | 50 A |
| Current Rating | 5 A |
| Fuse Type | Board Mount (Cartridge Style Excluded) |
| Melting I²t | 5.4 |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 1206 (3216 Metric), Concave |
| Response Time | Slow Blow |
| Size / Dimension Height | 0.042 in |
| Size / Dimension Length | 0.126 in |
| Size / Dimension Width | 0.063 in |
| Voltage Rating - DC | 32 V |
Pricing
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