
IRFR9024NTRPBF
ActivePOWER MOSFET, P CHANNEL, 55 V, 11 A, 0.175 OHM, TO-252AA, SURFACE MOUNT
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IRFR9024NTRPBF
ActivePOWER MOSFET, P CHANNEL, 55 V, 11 A, 0.175 OHM, TO-252AA, SURFACE MOUNT
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Technical Specifications
Parameters and characteristics for this part
| Specification | IRFR9024NTRPBF |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 11 A |
| Drain to Source Voltage (Vdss) | 55 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | P-Channel |
| Gate Charge (Qg) (Max) @ Vgs | 19 nC |
| Input Capacitance (Ciss) (Max) @ Vds [Max] | 350 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Power Dissipation (Max) | 38 W |
| Rds On (Max) @ Id, Vgs | 175 mOhm |
| Supplier Device Package | TO-252AA (DPAK) |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 4 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.94 | |
| 10 | $ 0.77 | |||
| 100 | $ 0.60 | |||
| 500 | $ 0.50 | |||
| 1000 | $ 0.41 | |||
| Digi-Reel® | 1 | $ 0.94 | ||
| 10 | $ 0.77 | |||
| 100 | $ 0.60 | |||
| 500 | $ 0.50 | |||
| 1000 | $ 0.41 | |||
| Tape & Reel (TR) | 2000 | $ 0.39 | ||
| 6000 | $ 0.37 | |||
| 10000 | $ 0.35 | |||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 1.31 | |
| 10 | $ 0.96 | |||
| 25 | $ 0.96 | |||
| 50 | $ 0.83 | |||
| 100 | $ 0.69 | |||
| 250 | $ 0.69 | |||
| 500 | $ 0.59 | |||
| 1000 | $ 0.53 | |||
Description
General part information
IRFR9024 Series
The IRFR9024NTRPBF is a HEXFET® fifth generation single P-channel Power MOSFET utilizes advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design, provides an extremely efficient device and reliable operation. It is designed for surface-mounting using vapour phase, infrared or wave soldering techniques. Power dissipation level up to 1.5W is possible in typical surface-mount applications.
Documents
Technical documentation and resources