Specification	TEM-125-02-07.0-H-D

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	3 µin
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Per Contact)	2.9 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.378 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mated Stacking Height	10 mm
Mounting Type	Surface Mount
Number of Positions	50
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.031 in
Row Spacing - Mating	0.063 in
Shrouding	Shrouded - 4 Wall
Style	Board
Termination	Solder

TEM-125 Series

Part	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Style	Shrouding	Insulation Color	Contact Length - Mating	Contact Material	Features	Number of Positions	Termination	Contact Type	Contact Finish Thickness - Mating	Current Rating (Per Contact)	Pitch - Mating	Fastening Type	Insulation Material	Number of Rows	Insulation Height	Row Spacing - Mating	Contact Finish - Mating	Mounting Type	Connector Type	Contact Shape	Number of Positions Loaded	Contact Finish Thickness - Post	Mated Stacking Height
Samtec Inc. TEM-125-02-DH1-F-D-A	Tin	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black	0.116 in	Phosphor Bronze	Board Guide	50	Solder	Male Pin	3 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.236 in	0.063 in	Gold	Right Angle Surface Mount	Header	Square	All
Samtec Inc. TEM-125-02-07.0-H-D-K-TR	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze	Pick and Place	50	Solder	Male Pin	30 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.378 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	10 mm
Samtec Inc. TEM-125-02-03.0-H-D	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze		50	Solder	Male Pin	30 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.22 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	6 mm
Samtec Inc. TEM-125-02-04.0-H-D	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze		50	Solder	Male Pin	30 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.26 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	7 mm
Samtec Inc. TEM-125-02-03.0-H-D-A-K-TR	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze	Board Guide Pick and Place	50	Solder	Male Pin	30 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.22 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	6 mm
Samtec Inc. TEM-125-02-07.0-G-D-WT	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze	Solder Retention	50	Solder	Male Pin	10 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.378 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	10 mm
Samtec Inc. TEM-125-02-03.0-G-D-K-TR	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze	Pick and Place	50	Solder	Male Pin	10 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.22 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	6 mm
Samtec Inc. TEM-125-02-07.0-FG-D-WT-K	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze	Pick and Place Solder Retention	50	Solder	Male Pin	3 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.378 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	10 mm
Samtec Inc. TEM-125-02-03.0-FG-D-LC	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze	Board Lock	50	Solder	Male Pin	3 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.22 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	6 mm
Samtec Inc. TEM-125-02-03.0-FG-D-WT-K	Gold	125 °C	-55 °C	Board	Shrouded - 4 Wall	Black		Phosphor Bronze	Pick and Place Solder Retention	50	Solder	Male Pin	3 µin	2.9 A	0.031 in	Push-Pull	Liquid Crystal Polymer (LCP)	2	0.22 in	0.063 in	Gold	Surface Mount	Header	Square	All	3 µin	6 mm

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