ESQT-130-03-G-Q-386

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Samtec Inc.

CONN SOCKET 120P 0.079 GOLD PCB

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ESQT-130-03-G-Q-386

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Samtec Inc.

CONN SOCKET 120P 0.079 GOLD PCB

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-130-03-G-Q-386

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Post [x]	1.83 mm
Contact Length - Post [x]	0.072 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	9.8 mm
Insulation Height	0.386 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	120
Number of Positions Loaded	All
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-130 Series

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Part	Contact Type	Number of Positions Loaded	Insulation Height [custom]	Insulation Height [custom]	Insulation Color	Fastening Type	Number of Positions	Row Spacing - Mating	Row Spacing - Mating	Contact Finish - Post	Mounting Type	Material Flammability Rating	Termination	Contact Length - Post	Contact Length - Post	Contact Shape	Number of Rows	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Contact Material	Connector Type	Style	Insulation Material	Contact Finish - Mating	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Height [z]	Insulation Height [z]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Insulation Height	Insulation Height
Samtec Inc. ESQT-130-02-L-D-420	Forked	All	0.42 in	10.67 mm	Black	Push-Pull	60	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.43 in	10.92 mm	Square	2	4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold
Samtec Inc. ESQT-130-02-L-Q-515	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder			Square		4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold	8.5 mm	0.335 in	0.515 "	13.08 mm
Samtec Inc. ESQT-130-03-G-Q-386	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder			Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold	1.83 mm	0.072 in			3 µin	0.076 µm	9.8 mm	0.386 in
Samtec Inc. ESQT-130-03-G-D-312	Forked	All			Black	Push-Pull	60	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder	0.146 in	3.7 mm	Square	2	4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold					3 µin	0.076 µm	7.92 mm	0.312 in
Samtec Inc. ESQT-130-02-L-D-310	Forked	All			Black	Push-Pull	60	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.54 in	13.72 mm	Square	2	4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold							7.87 mm	0.31 in
Samtec Inc. ESQT-130-03-G-Q-345	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder	0.113 in	2.87 mm	Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold			0.345 "	8.76 mm	3 µin	0.076 µm
Samtec Inc. ESQT-130-02-M-D-425	Forked	All			Black	Push-Pull	60	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.425 in	10.8 mm	Square	2	4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold							10.8 mm	0.425 in
Samtec Inc. ESQT-130-03-G-Q-400	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder	0.058 "	1.47 mm	Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold					3 µin	0.076 µm	10.16 mm	0.4 in
Samtec Inc. ESQT-130-02-MM-Q-600	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.25 in	6.35 mm	Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold							15.24 mm	0.6 in
Samtec Inc. ESQT-130-02-L-Q-707	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder			Square		4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold	3.63 mm	0.143 in					17.96 mm	0.707 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	9	$ 47.22

Description

General part information

ESQT-130 Series

120 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available