Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | MC100EP32DTG | 100EP32 Series |
---|---|---|
- | - | |
Count Rate | 4 GHz | 4 GHz |
Logic Type | Divide-by-2 | Divide-by-2 |
Mounting Type | Surface Mount | Surface Mount |
Number of Bits per Element | 1 | 1 |
Number of Elements | 1 | 1 |
Operating Temperature [Max] | 85 °C | 85 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Package / Case | 8-MSOP, 8-TSSOP | 8-VFDFN Exposed Pad, 8-MSOP, 8-TSSOP, 8-SOIC |
Package / Case | 3 mm | 3 mm |
Package / Case | - | 3.9 mm |
Package / Case | - | 0.154 in |
Package / Case [custom] | 0.118 in | 0.118 in |
Reset | Asynchronous | Asynchronous |
Supplier Device Package | 8-TSSOP | 8-DFN (2x2), 8-TSSOP, 8-SOIC |
Trigger Type | Negative, Positive | Negative, Positive |
Voltage - Supply [Max] | 5.5 V | 5.5 V |
Voltage - Supply [Min] | 3 V | 3 V |
100EP32 Series
CLOCK DIVIDER BUFFER 1-OUT 1-IN 1:1 8-PIN DFN EP T/R
Part | Supplier Device Package | Trigger Type | Voltage - Supply [Max] | Voltage - Supply [Min] | Mounting Type | Number of Bits per Element | Reset | Logic Type | Package / Case | Count Rate | Number of Elements | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case [custom] | Package / Case | Package / Case [y] | Package / Case [x] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor MC100EP32MNR4G | 8-DFN (2x2) | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-VFDFN Exposed Pad | 4 GHz | 1 | 85 °C | -40 °C | ||||
ON Semiconductor MC100EP32DTR2G | 8-TSSOP | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-MSOP, 8-TSSOP | 4 GHz | 1 | 85 °C | -40 °C | 0.118 in | 3 mm | ||
ON Semiconductor MC100EP32DR2G | 8-SOIC | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-SOIC | 4 GHz | 1 | 85 °C | -40 °C | 3.9 mm | 0.154 in | ||
ON Semiconductor MC100EP32DTG | 8-TSSOP | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-MSOP, 8-TSSOP | 4 GHz | 1 | 85 °C | -40 °C | 0.118 in | 3 mm | ||
ON Semiconductor MC100EP32DT | 8-TSSOP | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-MSOP, 8-TSSOP | 4 GHz | 1 | 85 °C | -40 °C | 0.118 in | 3 mm | ||
ON Semiconductor MC100EP32DR2 | 8-SOIC | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-SOIC | 4 GHz | 1 | 85 °C | -40 °C | 3.9 mm | 0.154 in | ||
ON Semiconductor MC100EP32DTR2 | 8-TSSOP | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-MSOP, 8-TSSOP | 4 GHz | 1 | 85 °C | -40 °C | 0.118 in | 3 mm | ||
ON Semiconductor MC100EP32DG | 8-SOIC | Negative, Positive | 5.5 V | 3 V | Surface Mount | 1 | Asynchronous | Divide-by-2 | 8-SOIC | 4 GHz | 1 | 85 °C | -40 °C | 3.9 mm | 0.154 in | ||
ON Semiconductor MC100EP32DTR2 REEL |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
100EP32 Series
The MC10/100EP32 is an integrated divide by 2 divider with differential CLK inputs.The VBBpin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBBas a switching reference voltage. VBBmay also rebias AC coupled inputs. When used, decouple VBBand VCCvia a 0.01μF capacitor and limit current sourcing or sinking to 0.5mA. When not used, VBBshould be left open.The reset pin is asynchronous and is asserted on the rising edge. Upon power-up, the internal flip-flops will attain a random state; the reset allows for the synchronization of multiple EP32's in a system.The 100 Series contains temperature compensation.
Documents
Technical documentation and resources