Specification	ESD-110-G-27

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Length - Post	0.265 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.4 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	20
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder

ESD-110 Series

IC & Component Sockets .100" Elevated Double Row Screw Machine Socket Strip

Part	Fastening Type	Insulation Color	Contact Type	Insulation Height	Termination	Row Spacing - Mating	Number of Positions	Connector Type	Contact Finish - Post	Style	Mounting Type	Contact Length - Post	Number of Rows	Material Flammability Rating	Pitch - Mating	Number of Positions Loaded	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Shape	Contact Material	Insulation Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Samtec Inc. ESD-125-TT-05	Push-Pull	Black	Female Socket	0.5 in	Solder	0.1 in	50	Elevated Socket	Tin	Board	Through Hole	0.165 in	2	UL94 V-0	0.1 in	All	Tin	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-125-G-26	Push-Pull	Black	Female Socket	0.3 in	Solder	0.1 in	50	Elevated Socket	Gold	Board	Through Hole	0.215 in	2	UL94 V-0	0.1 in	All	Gold	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin	10 µin
Samtec Inc. ESD-125-TT-06	Push-Pull	Black	Female Socket	0.3 in	Solder	0.1 in	50	Elevated Socket	Tin	Board	Through Hole	0.215 in	2	UL94 V-0	0.1 in	All	Tin	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-125-G-25	Push-Pull	Black	Female Socket	0.5 in	Solder	0.1 in	50	Elevated Socket	Gold	Board	Through Hole	0.165 in	2	UL94 V-0	0.1 in	All	Gold	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin	10 µin
Samtec Inc. ESD-125-T-03	Push-Pull	Black	Female Socket	0.3 in	Solder	0.1 in	50	Elevated Socket	Tin	Board	Through Hole	0.153 in	2	UL94 V-0	0.1 in	All	Gold	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESD-125-T-28	Push-Pull	Black	Female Socket	0.3 in	Solder	0.1 in	50	Elevated Socket	Tin	Board	Through Hole	0.365 in	2	UL94 V-0	0.1 in	All	Gold	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESD-125-TT-25	Push-Pull	Black	Female Socket	0.5 in	Solder	0.1 in	50	Elevated Socket	Tin	Board	Through Hole	0.165 in	2	UL94 V-0	0.1 in	All	Tin	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-125-G-27	Push-Pull	Black	Female Socket	0.4 in	Solder	0.1 in	50	Elevated Socket	Gold	Board	Through Hole	0.265 in	2	UL94 V-0	0.1 in	All	Gold	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin	10 µin
Samtec Inc. ESD-125-G-08	Push-Pull	Black	Female Socket	0.3 in	Solder	0.1 in	50	Elevated Socket	Gold	Board	Through Hole	0.365 in	2	UL94 V-0	0.1 in	All	Gold	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin	10 µin
Samtec Inc. ESD-125-G-23	Push-Pull	Black	Female Socket	0.3 in	Solder	0.1 in	50	Elevated Socket	Gold	Board	Through Hole	0.115 in	2	UL94 V-0	0.1 in	All	Gold	125 °C	-55 °C	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin	10 µin

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ESD-110-G-27 | Datasheet