Specification	SIP050-1X05-160B

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Closed Frame
Grid Columns	5
Grid Rows	1
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	5
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.095 in
Type	SIP

SIP050 Series

...

Part	Termination Post Length	Material Flammability Rating	Features	Contact Finish Thickness - Post	Contact Material - Mating	Pitch - Post	Mounting Type	Contact Finish - Mating	Contact Finish - Post	Pitch - Mating	Termination	Housing Material	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Type	Contact Material - Post
Amphenol ICC (FCI) SIP050-1X09-157B	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Tin	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	9	9	200 Ąin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X32-157B	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Tin	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	32	32	200 Ąin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X18-157B	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Tin	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	18	18	200 Ąin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X10-160B	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Gold	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	10	10	30 µin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X32-160BLF	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Gold	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	32	32	30 µin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X31-160BLF	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Gold	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	31	31	30 µin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X11-160B	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Gold	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	11	11	30 µin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X12-157BLF	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Tin	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	12	12 count	200 Ąin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X28-157BLF	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Tin	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	28	28	200 Ąin	SIP	Brass
Amphenol ICC (FCI) SIP050-1X26-157BLF	0.095 in	UL94 V-0	Closed Frame	200 µin	Beryllium Copper	0.1 in	Through Hole	Tin	Tin	0.1 in	Solder	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	1	26	26	200 Ąin	SIP	Brass

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