Specification	TMM-128-01-G-S

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	20 Ąin
Contact Finish Thickness - Post	3 µin
Contact Length - Mating	0.126 in
Contact Length - Post	0.138 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Per Contact)	3.2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.059 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	28
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Overall Contact Length	0.323 in
Pitch - Mating	0.079 in
Shrouding	Unshrouded
Style	Board, Board or Cable
Termination	Solder

TMM Series

...

Part	Contact Material	Insulation Material	Connector Type	Shrouding	Style	Current Rating (Per Contact)	Insulation Height	Fastening Type	Pitch - Mating	Contact Length - Post	Number of Positions	Contact Finish - Post	Row Spacing - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Type	Number of Positions Loaded	Insulation Color	Contact Finish - Mating	Termination	Number of Rows	Contact Length - Mating	Contact Shape	Contact Finish Thickness - Mating	Mounting Type	Material Flammability Rating	Overall Contact Length	Features	Contact Finish Thickness - Post	Number of Positions Loaded
Samtec Inc. TMM-103-01-S-D-RE	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.155 in	Push-Pull	0.079 in	0.12 in	6	Tin	0.079 in	125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	2	0.126 in	Square	30 µin	Right Angle Through Hole
Samtec Inc. TMM-130-01-S-D-SM	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in		60	Tin	0.079 in	125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	2	0.126 in	Square	30 µin	Surface Mount	UL94 V-0
Samtec Inc. TMM-108-01-S-D	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in	0.138 in	16	Tin	0.079 in	125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	2	0.126 in	Square	30 µin	Through Hole		0.323 in
Samtec Inc. TMM-114-01-S-S-SM-P	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in		14	Tin		125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	1	0.126 in	Square	30 µin	Surface Mount	UL94 V-0		Pick and Place
Samtec Inc. TMM-124-03-G-S	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in	0.106 in	24 pos	Gold		125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	1	0.157 in	Square	20 Ąin	Through Hole		0.323 in		3 µin
Samtec Inc. TMM-103-06-G-D-SM-P	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in		6	Gold	0.079 in	125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	2	0.168 in	Square	20 Ąin	Surface Mount	UL94 V-0		Pick and Place	3 µin
Samtec Inc. TMM-103-01-T-S-SM-P-TR	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in		3	Tin		105 °C	-55 °C	Male Pin	All	Black	Tin	Solder	1	0.126 in	Square		Surface Mount	UL94 V-0		Pick and Place
Samtec Inc. TMM-109-05-L-S	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in	0.09 in	9	Tin		125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	1	0.065 in	Square	10 µin	Through Hole		0.214 in
Samtec Inc. TMM-132-02-G-S	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in	0.118 in	32	Gold		125 °C	-55 °C	Male Pin	All	Black	Gold	Solder	1	0.146 in	Square	20 Ąin	Through Hole		0.323 in		3 µin
Samtec Inc. TMM-108-03-L-S-007	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Header	Unshrouded	Board Board or Cable	3.2 A	0.059 in	Push-Pull	0.079 in	0.106 in	8	Tin		125 °C	-55 °C	Male Pin		Black	Gold	Solder	1	0.157 in	Square	10 µin	Through Hole		0.323 in			7