115-87-952-41-001101

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Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

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115-87-952-41-001101

Active

Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	350	$ 3.09

Description

General part information

115-87 Series

52 (2 x 26) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	115-87-952-41-001101	115-87 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	Flash	Flash
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	-	8 - 64
Number of Positions or Pins (Grid)	-	2 x 5, 2 x 16
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid)	-	6 - 50
Number of Positions or Pins (Grid)	-	25
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	2.41 mm	2.41 mm
Termination Post Length	0.095 in	0.095 in
Type	22.86 mm	5.08 - 22.86 mm
Type	DIP	DIP
Type	0.9 in	0.2 - 0.9 in

115-87 Series

CONN IC DIP SOCKET 24POS GOLD

Part	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Material Flammability Rating	Type	Type	Type	Contact Material - Post [custom]	Mounting Type	Contact Finish - Mating	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Features	Contact Material - Mating	Current Rating (Amps)	Housing Material	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Resistance	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 115-87-624-41-003101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.6 in	15.24 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in	24	2.54 mm	0.1 in	Flash	10 mOhm
Preci-Dip 115-87-210-41-001101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.2 in	5.08 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in		2.54 mm	0.1 in	Flash	10 mOhm	2 x 5	10
Preci-Dip 115-87-304-41-001101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.3 "	7.62 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in		2.54 mm	0.1 in	Flash	10 mOhm			4
Preci-Dip 115-87-964-41-001101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.9 in	22.86 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in	64	2.54 mm	0.1 in	Flash	10 mOhm
Preci-Dip 115-87-640-41-003101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.6 in	15.24 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in	40	2.54 mm	0.1 in	Flash	10 mOhm				20	2
Preci-Dip 115-87-308-41-001101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.3 "	7.62 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in	8	2.54 mm	0.1 in	Flash	10 mOhm
Preci-Dip 115-87-314-41-003101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.3 "	7.62 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in	14	2.54 mm	0.1 in	Flash	10 mOhm
Preci-Dip 115-87-632-41-001101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.6 in	15.24 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in		2.54 mm	0.1 in	Flash	10 mOhm	2 x 16					32
Preci-Dip 115-87-306-41-001101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.3 "	7.62 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in		2.54 mm	0.1 in	Flash	10 mOhm				3	2		6
Preci-Dip 115-87-632-41-003101	-55 °C	125 °C	Solder	UL94 V-0	DIP	0.6 in	15.24 mm	Brass	Through Hole	Gold	Tin	0.1 in	2.54 mm	Open Frame	Beryllium Copper	1 A	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2.41 mm	0.095 in		2.54 mm	0.1 in	Flash	10 mOhm	2 x 16					32