116-83-210-41-011101

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Preci-Dip

10P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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116-83-210-41-011101

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Preci-Dip

10P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	360	$ 2.08
LCSC	Piece	1	$ 5.00
		200	$ 1.99
		360	$ 1.93
		1080	$ 1.90

Description

General part information

116-83 Series

10 (2 x 5) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	116-83-210-41-011101	116-83 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	29.5 Áin	29.5 Áin
Contact Finish Thickness - Mating	0.75 Ám	0.75 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame, Elevated	Open Frame, Elevated
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	2 - 48
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	6 - 50
Number of Positions or Pins (Grid)	-	25
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid) [custom]	2 x 5	2 x 5, 2 x 16
Number of Positions or Pins (Grid) [custom]	10	10
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	DIP	DIP
Type	5.08 mm	5.08 - 15.24 mm
Type	0.2 in	0.2 - 0.6 "

116-83 Series

CONN IC DIP SOCKET 4POS GOLD

...

Part	Termination	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Contact Material - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Termination Post Length	Termination Post Length	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Material Flammability Rating	Housing Material	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Resistance	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 116-83-304-41-008101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	4	Through Hole	0.1 in	2.54 mm	10 mOhm
Preci-Dip 116-83-422-41-011101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	22
Preci-Dip 116-83-324-41-012101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	24
Preci-Dip 116-83-420-41-008101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	20
Preci-Dip 116-83-210-41-002101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.2 in	5.08 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm		2 x 5	10
Preci-Dip 116-83-316-41-012101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	16
Preci-Dip 116-83-424-41-008101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	24
Preci-Dip 116-83-322-41-006101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	22
Preci-Dip 116-83-328-41-007101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	28
Preci-Dip 116-83-420-41-004101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	20