W25M02GVTCIG TR
ActiveWinbond Electronics
IC FLASH 2GBIT SPI 24TFBGA
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W25M02GVTCIG TR
ActiveWinbond Electronics
IC FLASH 2GBIT SPI 24TFBGA
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W25M02GVTCIG TR | W25M02 Series |
|---|---|---|
| Access Time | - | 7 ns |
| Clock Frequency | 104 MHz | 104 MHz |
| Memory Format | FLASH | FLASH |
| Memory Interface | SPI | SPI - Quad I/O, SPI |
| Memory Organization | 256M x 8 | 256M x 8 |
| Memory Size | 2 Gbit | 2 Gbit |
| Memory Type | Non-Volatile | Non-Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 85 °C | 85 - 105 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 24-TBGA | 8-WDFN Exposed Pad, 16-SOIC, 24-TBGA |
| Package / Case | - | 0.295 in |
| Package / Case | - | 7.5 mm |
| Supplier Device Package | 24-TFBGA (8x6) | 8-WSON (8x6), 16-SOIC, 24-TFBGA (8x6) |
| Technology | FLASH - NAND (SLC) | FLASH - NAND (SLC) |
| Voltage - Supply [Max] | 3.6 V | 1.95 - 3.6 V |
| Voltage - Supply [Min] | 2.7 V | 1.7 - 2.7 V |
| Write Cycle Time - Word, Page | 700 µs | 700 µs |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
W25M02 Series
IC FLASH 2GBIT SPI/QUAD 8WSON
| Part | Memory Interface | Memory Size | Voltage - Supply [Min] | Voltage - Supply [Max] | Technology | Package / Case | Memory Type | Write Cycle Time - Word, Page | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Mounting Type | Clock Frequency | Memory Format | Access Time | Memory Organization | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25M02GVZEJG | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Non-Volatile | 700 µs | 105 °C | -40 °C | 8-WSON (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVSFJR | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 16-SOIC | Non-Volatile | 700 µs | 105 °C | -40 °C | 16-SOIC | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | 0.295 in | 7.5 mm |
Winbond Electronics W25M02GVSFJT | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 16-SOIC | Non-Volatile | 700 µs | 105 °C | -40 °C | 16-SOIC | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | 0.295 in | 7.5 mm |
Winbond Electronics W25M02GVTCJT | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 105 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVSFJG | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 16-SOIC | Non-Volatile | 700 µs | 105 °C | -40 °C | 16-SOIC | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | 0.295 in | 7.5 mm |
Winbond Electronics W25M02GVTBIG TR | SPI | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 | |||
Winbond Electronics W25M02GVTBIT TR | SPI | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 | |||
Winbond Electronics W25M02GVTCIT | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 | |||
Winbond Electronics W25M02GVTBIR | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVTCIG TR | SPI | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 | |||
Winbond Electronics W25M02GVTBJT | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 105 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVZEIG TR | SPI | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Non-Volatile | 700 µs | 85 °C | -40 °C | 8-WSON (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 | |||
Winbond Electronics W25M02GVTBIG | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVSFIT | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 16-SOIC | Non-Volatile | 700 µs | 85 °C | -40 °C | 16-SOIC | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | 0.295 in | 7.5 mm |
Winbond Electronics W25M02GVZEJR | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Non-Volatile | 700 µs | 105 °C | -40 °C | 8-WSON (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVTCIT TR | SPI | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 | |||
Winbond Electronics W25M02GVZEIR | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Non-Volatile | 700 µs | 85 °C | -40 °C | 8-WSON (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVTCIG | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVZEJT | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Non-Volatile | 700 µs | 105 °C | -40 °C | 8-WSON (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVTBJR | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 105 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVTBJG | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 105 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVSFIG | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 16-SOIC | Non-Volatile | 700 µs | 85 °C | -40 °C | 16-SOIC | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | 0.295 in | 7.5 mm |
Winbond Electronics W25M02GVSFIR | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 16-SOIC | Non-Volatile | 700 µs | 85 °C | -40 °C | 16-SOIC | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | 0.295 in | 7.5 mm |
Winbond Electronics W25M02GVTCIR | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 85 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GVTCJG | SPI - Quad I/O | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 24-TBGA | Non-Volatile | 700 µs | 105 °C | -40 °C | 24-TFBGA (8x6) | Surface Mount | 104 MHz | FLASH | 7 ns | 256M x 8 | ||
Winbond Electronics W25M02GWZEIG | SPI - Quad I/O | 2 Gbit | 1.7 V | 1.95 V | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Non-Volatile | 700 µs | 85 °C | -40 °C | 8-WSON (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 | |||
Winbond Electronics W25M02GVZEIT TR | SPI | 2 Gbit | 2.7 V | 3.6 V | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Non-Volatile | 700 µs | 85 °C | -40 °C | 8-WSON (8x6) | Surface Mount | 104 MHz | FLASH | 256M x 8 |
Description
General part information
W25M02 Series
FLASH - NAND (SLC) Memory IC 2Gbit SPI 104 MHz 24-TFBGA (8x6)
Documents
Technical documentation and resources