JET551SNL30T5
ActiveChip Quik Inc.
JET PRINTING SOLDER PASTE SN96.5
JET551SNL30T5
ActiveChip Quik Inc.
JET PRINTING SOLDER PASTE SN96.5
Description
General part information
JET551SNL30T5
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 3.53 oz (100g)
Technical Specifications
Parameters and characteristics for this part
| Specification | JET551SNL30T5 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Syringe |
| Form Weight | 3.53 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Type | Solder Paste |
Pricing
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