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1N4704UR-1/TR - DO-213AA

1N4704UR-1/TR

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Microchip Technology

ZENER DIODE SINGLE 2-PIN 17V, 5%, 500MW DO-213AA BAG

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1N4704UR-1/TR - DO-213AA

1N4704UR-1/TR

Active
Microchip Technology

ZENER DIODE SINGLE 2-PIN 17V, 5%, 500MW DO-213AA BAG

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification1N4704UR-1/TR1N4704UR-1-Zener-Diode Series
Current - Reverse Leakage @ Vr50 nA50 nA
Mounting TypeSurface MountSurface Mount
Operating Temperature [Max]175 ░C175 ░C
Operating Temperature [Min]-65 °C-65 °C
Package / CaseDO-213AADO-213AA
Power - Max [Max]500 mW500 mW
Supplier Device PackageDO-213AADO-213AA
Tolerance5 %5 %
Voltage - Forward (Vf) (Max) @ If [Max]1.5 V1.5 V
Voltage - Zener (Nom) (Vz)17 V17 V

1N4704UR-1-Zener-Diode Series

Zener Diode Single 2-Pin 17V, 5%, 500mW DO-213AA Bag

PartOperating Temperature [Max]Operating Temperature [Min]Mounting TypeSupplier Device PackageTolerancePackage / CaseVoltage - Zener (Nom) (Vz)Power - Max [Max]Voltage - Forward (Vf) (Max) @ If [Max]Current - Reverse Leakage @ Vr
Microchip Technology
1N4704UR-1/TR
175 ░C
-65 °C
Surface Mount
DO-213AA
5 %
DO-213AA
17 V
500 mW
1.5 V
50 nA
Microchip Technology
1N4704UR-1
175 ░C
-65 °C
Surface Mount
DO-213AA
5 %
DO-213AA
17 V
500 mW
1.5 V
50 nA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.89
Digi-Reel® 1$ 4.89
Tape & Reel (TR) 186$ 4.54
Microchip DirectN/A 1$ 4.89
100$ 4.54
500$ 4.36
1000$ 4.12
NewarkEach 100$ 4.54
500$ 4.36

Description

General part information

1N4704UR-1-Zener-Diode Series

The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount DO-213AA Zener voltage regulators provides a selection from 1.8 to 43 volts. Standard tolerance is +/-5%, with 1% and 2% options available. The Zener test current is only 50 uA. The metal slugs that sandwich the die are metallurgically bonded to the silicon for high reliability. This type of internally bonded Zener package construction is also available with high-reliability up screening as described in the Features section. Microchip also offers numerous other Zener products to meet higher and lower power applications.

Documents

Technical documentation and resources