SMD291SNL50T6

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Chip Quik Inc.

SOLDER PASTE IN JAR 50G (T6) SAC

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Chip Quik Inc.

SOLDER PASTE IN JAR 50G (T6) SAC

Technical Specifications

Parameters and characteristics commom to parts in this series

SOLDER PASTE IN JAR 50G (T6) SAC

Part	Mesh Type	Composition	Flux Type	Type	Shelf Life	Form	Form	Form	Shelf Life Start	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Form
Chip Quik Inc. SMD291SNL50T6	6	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	No-Clean	Solder Paste	6 Months	Jar	1.76 oz	50 g	Date of Manufacture	428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. SMD291SNLT6	6	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	No-Clean	Solder Paste	6 Months	Syringe		15 g	Date of Manufacture	428 °F	217 °C	220 °C	422 °F	0.53 oz, 5 ml

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 99.95

General part information

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)

Technical documentation and resources