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TN2524N8-G - Trans MOSFET N-CH 240V 0.36A 4-Pin(3+Tab) SOT-89

TN2524N8-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 240V, 6.0 OHM

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TN2524N8-G - Trans MOSFET N-CH 240V 0.36A 4-Pin(3+Tab) SOT-89

TN2524N8-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 240V, 6.0 OHM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTN2524N8-GTN2524 Series
Current - Continuous Drain (Id) @ 25°C-360 mA
Drain to Source Voltage (Vdss)-240 V
Drive Voltage (Max Rds On, Min Rds On)-4.5 - 10 V
FET Type-N-Channel
Input Capacitance (Ciss) (Max) @ Vds-125 pF
Mounting Type-Surface Mount
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-TO-243AA
Power Dissipation (Max)-1.6 W
Rds On (Max) @ Id, Vgs-6 Ohm
Supplier Device Package-TO-243AA (SOT-89)
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.54
25$ 1.28
100$ 1.15
Digi-Reel® 1$ 1.54
25$ 1.28
100$ 1.15
Tape & Reel (TR) 2000$ 1.15
Microchip DirectT/R 1$ 1.54
25$ 1.28
100$ 1.15
1000$ 0.98
5000$ 0.89
10000$ 0.81

TN2524 Series

MOSFET, N-Channel Enhancement-Mode, 240V, 6.0 Ohm

PartVgs(th) (Max) @ IdDrive Voltage (Max Rds On, Min Rds On)Package / CaseMounting TypeTechnologyInput Capacitance (Ciss) (Max) @ VdsVgs (Max)Power Dissipation (Max)Operating Temperature [Min]Operating Temperature [Max]Supplier Device PackageDrain to Source Voltage (Vdss)Current - Continuous Drain (Id) @ 25°CFET TypeRds On (Max) @ Id, Vgs
Microchip Technology
TN2524N8-G
Microchip Technology
TN2524N8-G
2 V
4.5 V, 10 V
TO-243AA
Surface Mount
MOSFET (Metal Oxide)
125 pF
20 V
1.6 W
-55 °C
150 °C
TO-243AA (SOT-89)
240 V
360 mA
N-Channel
6 Ohm

Description

General part information

TN2524 Series

This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and with the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.