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IRFP064NPBF - TO-247-3 AC EP

IRFP064NPBF

Active
Infineon Technologies

POWER MOSFET, GENERAL PURPOSE, N CHANNEL, 55 V, 110 A, 0.008 OHM, TO-247AC, THROUGH HOLE

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IRFP064NPBF - TO-247-3 AC EP

IRFP064NPBF

Active
Infineon Technologies

POWER MOSFET, GENERAL PURPOSE, N CHANNEL, 55 V, 110 A, 0.008 OHM, TO-247AC, THROUGH HOLE

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Technical Specifications

Parameters and characteristics for this part

SpecificationIRFP064NPBF
Current - Continuous Drain (Id) @ 25°C110 A
Drain to Source Voltage (Vdss)55 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs170 nC
Input Capacitance (Ciss) (Max) @ Vds4000 pF
Mounting TypeThrough Hole
Operating Temperature [Max]175 ░C
Operating Temperature [Min]-55 °C
Package / CaseTO-247-3
Power Dissipation (Max)200 W
Rds On (Max) @ Id, Vgs [Max]8 mOhm
Supplier Device PackageTO-247AC
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4 V

IRFP064 Series

PartPackage / CaseSupplier Device PackagePower Dissipation (Max)Input Capacitance (Ciss) (Max) @ VdsDrain to Source Voltage (Vdss)Vgs (Max)Vgs(th) (Max) @ IdMounting TypeTechnologyCurrent - Continuous Drain (Id) @ 25°COperating Temperature [Min]Operating Temperature [Max]FET TypeDrive Voltage (Max Rds On, Min Rds On)Gate Charge (Qg) (Max) @ VgsRds On (Max) @ Id, Vgs [Max]
Infineon Technologies
TO-247-3
TO-247AC
200 W
4000 pF
55 V
20 V
4 V
Through Hole
MOSFET (Metal Oxide)
110 A
-55 °C
175 ░C
N-Channel
10 V
170 nC
8 mOhm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 3.74
10$ 2.45
100$ 1.72
500$ 1.41
1000$ 1.31
2000$ 1.28

Description

General part information

IRFP064 Series

The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications.The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design.

Documents

Technical documentation and resources