
ATS-PCB1073
ActiveAdvanced Thermal Solutions Inc.
HEAT SINKS BGA HEAT SINK, BOARD LEVEL STAMP, NO TIM, TIN PLATE, TO220, 12.7X26.2X10.21MM

ATS-PCB1073
ActiveAdvanced Thermal Solutions Inc.
HEAT SINKS BGA HEAT SINK, BOARD LEVEL STAMP, NO TIM, TIN PLATE, TO220, 12.7X26.2X10.21MM
Description
General part information
ATS-PCB Series
Heat Sink TO-263 (D²Pak) Copper Top Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | ATS-PCB1073 |
|---|---|
| Fin Height | 0.402 in |
| Length | 0.5 in |
| Material | Copper |
| Material Finish | Tin |
| Package Cooled | TO-263 (D²Pak) |
| Shape | Fins, Rectangular |
| Thermal Resistance | 18 °C/W, 9.5 °C/W |
| Type | Top Mount |
| Width | 1.031 in |
Pricing
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CAD
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Documents
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