Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | STEVAL-BFA001V2B | STEVAL-BFA001V2B Series |
|---|---|---|
| - | - | |
| Embedded | MCU, 32-Bit | MCU, 32-Bit |
| Embedded | True | True |
| Sensor Type | Humidity, Temperature, Pressure, Sound, Gyroscope, Accelerometer | Humidity, Temperature, Pressure, Sound, Gyroscope, Accelerometer |
| Supplied Contents | Board(s), Accessories, Cable(s) | Board(s), Accessories, Cable(s) |
| Utilized IC / Part | STM32F469 | STM32F469 |
| Voltage - Supply [Max] | 32 VDC | 32 VDC |
| Voltage - Supply [Min] | 18 V | 18 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
STEVAL-BFA001V2B Series
Multi-sensor predictive maintenance kit with IO-Link stack v.1.1
| Part | Sensor Type | Embedded | Embedded | Voltage - Supply [Min] | Voltage - Supply [Max] | Utilized IC / Part | Supplied Contents |
|---|---|---|---|---|---|---|---|
STMicroelectronics STEVAL-BFA001V2B | Accelerometer, Gyroscope, Humidity, Pressure, Sound, Temperature | 32-Bit, MCU | 18 V | 32 VDC | STM32F469 | Accessories, Board(s), Cable(s) | |
STMicroelectronics STEVAL-BFA001V2B | |||||||
STMicroelectronics STEVAL-BFA001V2B | |||||||
STMicroelectronics STEVAL-BFA001V2B |
Description
General part information
STEVAL-BFA001V2B Series
The STEVAL-BFA001V2B is an industrial reference design kit for condition monitoring (CM) and predictive maintenance (PdM), in a layout that is designed to meet IEC61000-4-2/4 and EN60947 requirements for industrial applications.
The hardware consists of a highly compact (50 x 9 x 9 mm) industrial sensor board specifically designed for real industrial applications, and the necessary debugging tools, cables, plugs and adapters for an industrial communications scenario. The connection is managed using a standard multipolar cable with one wire used for IO-Link data.
The STSW-BFA001V2 firmware package (freely available on www.st.com) includes dedicated algorithms for advanced time and frequency domain signal processing and analysis of the high bandwidth 3D digital accelerometer for vibration monitoring. The package includes pressure, relative humidity and temperature sensor monitoring samples as well as audio algorithms for acoustic emission (AE).