115-83-320-41-001101

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Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

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115-83-320-41-001101

Active

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 3.00
		20	$ 2.12
		100	$ 1.77
		500	$ 1.49
		1000	$ 1.39
		5000	$ 1.19

Description

General part information

115-83 Series

20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	115-83-320-41-001101	115-83 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	29.5 Áin	29.5 Áin
Contact Finish Thickness - Mating	0.75 Ám	0.75 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	20	8 - 48
Number of Positions or Pins (Grid)	-	2 x 5
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	25
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	6 - 50
Number of Positions or Pins (Grid)	-	3 - 20
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	2.41 mm	2.41 mm
Termination Post Length	0.095 in	0.095 in
Type	0.3 "	0.2 - 0.9 in
Type	7.62 mm	5.08 - 22.86 mm
Type	DIP	DIP

115-83 Series

CONN IC DIP SOCKET 10POS GOLD

Part	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Finish - Mating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Resistance	Termination	Features	Contact Material - Mating	Housing Material	Material Flammability Rating	Type	Type	Type	Mounting Type	Number of Positions or Pins (Grid)
Preci-Dip 115-83-210-41-001101	Brass	2 x 5	10	-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	5.08 mm	0.2 in	Through Hole
Preci-Dip 115-83-324-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	24
Preci-Dip 115-83-308-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	8
Preci-Dip 115-83-636-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	15.24 mm	0.6 in	Through Hole	36
Preci-Dip 115-83-318-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	18
Preci-Dip 115-83-422-41-001101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	10.16 mm	0.4 in	Through Hole	22
Preci-Dip 115-83-628-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	15.24 mm	0.6 in	Through Hole	28
Preci-Dip 115-83-320-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	20
Preci-Dip 115-83-310-41-001101	Brass	2 x 5	10	-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole
Preci-Dip 115-83-308-41-003101	Brass			-55 °C	125 °C	2.54 mm	0.1 in	29.5 Áin	0.75 Ám	1 A	Gold	2.41 mm	0.095 in	0.1 in	2.54 mm	Tin	10 mOhm	Solder	Open Frame	Beryllium Copper	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	UL94 V-0	DIP	7.62 mm	0.3 "	Through Hole	8