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W25N01GWZEIG - 8 WSON

W25N01GWZEIG

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Winbond Electronics

IC FLASH 1GBIT SPI/QUAD 8WSON

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W25N01GWZEIG - 8 WSON

W25N01GWZEIG

Active
Winbond Electronics

IC FLASH 1GBIT SPI/QUAD 8WSON

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DocumentsDatasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationW25N01GWZEIGW25N01 Series
Access Time8 ns6 - 8 ns
Clock Frequency104 MHz104 - 166 MHz
Memory FormatFLASHFLASH
Memory InterfaceSPI - Quad I/OSPI - Quad I/O, DTR, Quad I/O, SPI, QPI
Memory Organization128 M128 M
Memory Size1 Mbit1 Mbit
Memory TypeNon-VolatileNon-Volatile
Mounting TypeSurface MountSurface Mount
Operating Temperature [Max]85 °C85 °C
Operating Temperature [Min]-40 °C-40 °C
Package / Case8-WDFN Exposed Pad24-TBGA, 8-WDFN Exposed Pad, 16-SOIC
Package / Case-0.295 in
Package / Case-7.5 mm
Supplier Device Package8-WSON (8x6)24-TFBGA (8x6), 8-WSON (8x6), 16-SOIC
TechnologyFLASH - NAND (SLC)FLASH - NAND (SLC), FLASH - NAND
Voltage - Supply [Max]1.95 V1.95 - 3.6 V
Voltage - Supply [Min]1.7 V1.7 - 2.7 V
Write Cycle Time - Word, Page700 µs700 µs

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 3.42
10$ 3.19
25$ 3.10
50$ 3.03
100$ 2.95
480$ 2.79
960$ 2.72
1440$ 2.68

W25N01 Series

IC FLASH 1GBIT SPI/QUAD 24TFBGA

PartWrite Cycle Time - Word, PagePackage / CaseMemory InterfaceMemory OrganizationTechnologyVoltage - Supply [Max]Voltage - Supply [Min]Memory SizeSupplier Device PackageMemory TypeClock FrequencyMemory FormatMounting TypeOperating Temperature [Max]Operating Temperature [Min]Access TimePackage / Case [x]Package / Case [y]
Winbond Electronics
W25N01GWTBIG
700 µs
24-TBGA
SPI - Quad I/O
128 M
FLASH - NAND (SLC)
1.95 V
1.7 V
1 Mbit
24-TFBGA (8x6)
Non-Volatile
104 MHz
FLASH
Surface Mount
85 °C
-40 °C
Winbond Electronics
W25N01GWZEIG
700 µs
8-WDFN Exposed Pad
SPI - Quad I/O
128 M
FLASH - NAND (SLC)
1.95 V
1.7 V
1 Mbit
8-WSON (8x6)
Non-Volatile
104 MHz
FLASH
Surface Mount
85 °C
-40 °C
8 ns
Winbond Electronics
W25N01GWTCIT
700 µs
24-TBGA
SPI - Quad I/O
128 M
FLASH - NAND (SLC)
1.95 V
1.7 V
1 Mbit
24-TFBGA (8x6)
Non-Volatile
104 MHz
FLASH
Surface Mount
85 °C
-40 °C
8 ns
Winbond Electronics
W25N01JWZEIG
700 µs
8-WDFN Exposed Pad
DTR, Quad I/O, SPI
128 M
FLASH - NAND (SLC)
1.95 V
1.7 V
1 Mbit
8-WSON (8x6)
Non-Volatile
166 MHz
FLASH
Surface Mount
85 °C
-40 °C
Winbond Electronics
W25N01JWSFIG TR
700 µs
16-SOIC
DTR, QPI, Quad I/O, SPI
128 M
FLASH - NAND (SLC)
1.95 V
1.7 V
1 Mbit
16-SOIC
Non-Volatile
166 MHz
FLASH
Surface Mount
85 °C
-40 °C
6 ns
0.295 in
7.5 mm
Winbond Electronics
W25N01GVZEIG TR
8-WDFN Exposed Pad
SPI
128 M
FLASH - NAND
3.6 V
2.7 V
1 Mbit
8-WSON (8x6)
Non-Volatile
104 MHz
FLASH
Surface Mount
85 °C
-40 °C
Winbond Electronics
W25N01GVZEIT TR
8-WDFN Exposed Pad
SPI
128 M
FLASH - NAND
3.6 V
2.7 V
1 Mbit
8-WSON (8x6)
Non-Volatile
104 MHz
FLASH
Surface Mount
85 °C
-40 °C
Winbond Electronics
W25N01GVSFIT
700 µs
16-SOIC
SPI - Quad I/O
128 M
FLASH - NAND (SLC)
3.6 V
2.7 V
1 Mbit
16-SOIC
Non-Volatile
104 MHz
FLASH
Surface Mount
85 °C
-40 °C
0.295 in
7.5 mm

Description

General part information

W25N01 Series

FLASH - NAND (SLC) Memory IC 1Gbit SPI - Quad I/O 104 MHz 8 ns 8-WSON (8x6)

Documents

Technical documentation and resources