01-0518-11H

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Aries Electronics

CONN SOCKET SIP 1POS GOLD

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Aries Electronics

CONN SOCKET SIP 1POS GOLD

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1191	$ 0.35

General part information

1 (1 x 1) Pos SIP Socket Gold Through Hole

Technical documentation and resources

Parameters and characteristics commom to parts in this series

Specification	01-0518-11H	01-0518 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold, Tin
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	10 çin	10 - 200 çin
Contact Finish Thickness - Post	0.25 çm	0.25 - 5.08 çm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	1	1
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	SIP	SIP

CONN SOCKET SIP 1POS GOLD

Part	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Features	Housing Material	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Contact Material - Mating	Contact Finish - Post	Contact Finish - Mating	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Material Flammability Rating	Mounting Type
Aries Electronics 01-0518-11	Brass	3.18 mm	0.125 in	Open Frame	Glass Filled, Nylon 4/6, Polyamide (PA46)	3 A	2.54 mm	0.1 in	Solder	Beryllium Copper	Gold	Gold	SIP	10 çin	0.25 çm	0.1 in	2.54 mm	10 çin	0.25 çm	1	UL94 V-0	Through Hole
Aries Electronics 01-0518-11H	Brass	3.18 mm	0.125 in	Open Frame	Glass Filled, Nylon 4/6, Polyamide (PA46)	3 A	2.54 mm	0.1 in	Solder	Beryllium Copper	Gold	Gold	SIP	10 çin	0.25 çm	0.1 in	2.54 mm	10 çin	0.25 çm	1	UL94 V-0	Through Hole
Aries Electronics 01-0518-10T	Brass	3.18 mm	0.125 in	Open Frame	Glass Filled, Nylon 4/6, Polyamide (PA46)	3 A	2.54 mm	0.1 in	Solder	Beryllium Copper	Tin	Gold	SIP	200 µin	5.08 µm	0.1 in	2.54 mm	10 çin	0.25 çm	1	UL94 V-0	Through Hole
Aries Electronics 01-0518-10	Brass	3.18 mm	0.125 in	Open Frame	Glass Filled, Nylon 4/6, Polyamide (PA46)	3 A	2.54 mm	0.1 in	Solder	Beryllium Copper	Tin	Gold	SIP	200 µin	5.08 µm	0.1 in	2.54 mm	10 çin	0.25 çm	1	UL94 V-0	Through Hole