Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | TDA7567PD | TDA7567PD Series |
|---|---|---|
| Features | - | Mute, I2C, Differential Inputs, Short-Circuit and Thermal Protection, Standby |
| Max Output Power x Channels @ Load | - | 75 W |
| Max Output Power x Channels @ Load | - | 4 |
| Max Output Power x Channels @ Load | - | 2 Ohm |
| Mounting Type | - | Surface Mount |
| null | - | |
| Operating Temperature | - | -55 °C |
| Operating Temperature | - | 150 °C |
| Output Type | - | 4-Channel (Quad) |
| Package / Case | - | PowerSO-36 Exposed Top Pad |
| Type | - | Class AB |
| Voltage - Supply | - | 8 V |
| Voltage - Supply | - | 18 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
TDA7567PD Series
4 x 50 W differential quad power amplifier with built-in diagnostics features
| Part | Mounting Type | Package / Case | Max Output Power x Channels @ Load [custom] | Max Output Power x Channels @ Load [custom] | Max Output Power x Channels @ Load [custom] | Voltage - Supply [Min] | Voltage - Supply [Max] | Type | Features | Output Type | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics TDA7567PD | ||||||||||||
STMicroelectronics TDA7567PDTR | Surface Mount | PowerSO-36 Exposed Top Pad | 75 W | 4 | 2 Ohm | 8 V | 18 V | Class AB | Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby | 4-Channel (Quad) | -55 °C | 150 °C |
STMicroelectronics TDA7567PDTR |
Description
General part information
TDA7567PD Series
The TDA7567PD is a new BCD technology quad bridge power amplifier in PowerSO36 package specially intended for automotive applications.
Thanks to the DMOS output stage the TDA7567PD has a very low distortion allowing a clear powerful sound. Among the features, its superior efficiency performance coming from the internal exclusive structure, makes it the most suitable device to simplify the thermal management in high power sets.
The dissipated output power under average listening condition is in fact reduced up to 50 % when compared to the level provided by conventional class AB solutions.
Documents
Technical documentation and resources