C0G with KONNEKT™ technology, automotive grade, surface mount multilayer ceramic chip capacitors (SMD MLCCs) designed for high-efficiency and high-density power applications. KONNEKT™ high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers and resonators where high efficiency is a primary concern. With an operating temperature range up to 125°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications which require minimal cooling. C0G with KONNEKT™ technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.