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ZSSC3230BI1B

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Renesas Electronics Corporation

WAFER UNSAWN, 304

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ZSSC3230BI1B

Active
Renesas Electronics Corporation

WAFER UNSAWN, 304

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationZSSC3230BI1BZSSC3230 Series
--
Contents-Board(s)
Current - Supply1.1 mA1.1 mA
Function-Sensor Signal Conditioner
Input TypeDigital, AnalogDigital, Analog
Mounting TypeSurface MountSurface Mount
Operating Temperature [Max]125 °C70 - 125 °C
Operating Temperature [Min]-40 °C-40 - 0 °C
Output TypeI2C, SerialSerial, I2C
Package / CaseDie24-VFQFN Exposed Pad, Die
Proximity Detection-False
Resolution-14 b
Supplied Contents-Board(s)
Supplier Device PackageDieDie
TypeCapacitive SensorCapacitive Sensor, Interface

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 21787$ 1.10
Tray 21787$ 1.25

ZSSC3230 Series

PQFN / 24 / 4X4MM G1 - TAPE&REE

PartInput TypePackage / CaseOutput TypeOperating Temperature [Min]Operating Temperature [Max]Current - SupplyTypeMounting TypeSupplied ContentsFunctionContentsResolutionProximity DetectionSupplier Device Package
Renesas Electronics Corporation
ZSSC3230BI3R
Analog, Digital
24-VFQFN Exposed Pad
I2C, Serial
-40 °C
125 °C
1.1 mA
Capacitive Sensor
Surface Mount
Renesas Electronics Corporation
ZSSC3230KIT
Renesas Electronics Corporation
ZSSC3230KIT
Interface
Board(s)
Sensor Signal Conditioner
Board(s)
Renesas Electronics Corporation
ZSSC3230BC3R
Analog, Digital
24-VFQFN Exposed Pad
I2C, Serial
-40 °C, 0 °C
70 °C, 85 °C
1.1 mA
Capacitive Sensor
Surface Mount
Renesas Electronics Corporation
ZSSC3230BI3W
24-VFQFN Exposed Pad
-40 °C
125 °C
Surface Mount
14 b
Renesas Electronics Corporation
ZSSC3230BI1B
Analog, Digital
Die
I2C, Serial
-40 °C
125 °C
1.1 mA
Capacitive Sensor
Surface Mount
Die

Description

General part information

ZSSC3230 Series

WAFER UNSAWN, 304

Documents

Technical documentation and resources