TE0803-03-5DI21-A

Obsolete

Trenz Electronic

MODULE SOM TE0803-03

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Obsolete

Trenz Electronic

MODULE SOM TE0803-03

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	TE0803-03-5DI21-A	TE0803 Series

Connector Type	-	B2B
Core Processor	-	Zynq UltraScale+ XCZU2CG-1SFVC784E, Zynq UltraScale+ XCZU2EG-1SFVC784E, Zynq UltraScale+ XCZU4EV-1SFVC784E, Zynq UltraScale+ XCZU5EV-1SFVC784E, Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size	-	128 MB
Module/Board Type	-	MPU Core
null		-
Operating Temperature	-	0 °C
Operating Temperature	-	85 °C
RAM Size	-	2 - 4 GB
Size / Dimension	-	2.05 - 2.99 in
Size / Dimension	-	52 - 76 mm
Size / Dimension	-	52 - 76 mm
Size / Dimension	-	2.05 - 2.99 "

IC MODULE ZYNQ USCALE 2GB 128MB

Part	Core Processor	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Connector Type	Module/Board Type	RAM Size	Flash Size	Operating Temperature [Min]	Operating Temperature [Max]
Trenz Electronic TE0803-03-3AE11-A	Zynq UltraScale+ XCZU2CG-1SFVC784E	2.99 in	76 mm	52 mm	2.05 "	B2B	MPU Core	2 GB	128 MB	0 °C	85 °C
Trenz Electronic TE0803-03-2BE11-A	Zynq UltraScale+ XCZU2EG-1SFVC784E	2.99 in	76 mm	52 mm	2.05 "	B2B	MPU Core	2 GB	128 MB	0 °C	85 °C
Trenz Electronic TE0803-03-4DE21-L	Zynq UltraScale+ XCZU4EV-1SFVC784E	2.99 in	76 mm	52 mm	2.05 "	B2B	MPU Core	4 GB	128 MB	0 °C	85 °C
Trenz Electronic TE0803-03-5DE11-A	Zynq UltraScale+ XCZU5EV-1SFVC784E	2.99 in	76 mm	52 mm	2.05 "	B2B	MPU Core	2 GB	128 MB	0 °C	85 °C
Trenz Electronic TE0803-03-2AE11-A	Zynq UltraScale+ XCZU2CG-1SFVC784E	2.99 in	76 mm	52 mm	2.05 "	B2B	MPU Core	2 GB	128 MB	0 °C	85 °C
Trenz Electronic TE0803-01-04CG-1EA	Zynq UltraScale+ XCZU4CG-1SFVC784E	2.05 in	52 mm	76 mm	2.99 in	B2B	MPU Core	2 GB	128 MB	0 °C	85 °C
Trenz Electronic TE0803-03-4DE11-A	Zynq UltraScale+ XCZU4EV-1SFVC784E	2.99 in	76 mm	52 mm	2.05 "	B2B	MPU Core	2 GB	128 MB	0 °C	85 °C
Trenz Electronic TE0803-03-5DI21-A

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

* Embedded Module

Technical documentation and resources