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ISZ230N10NM6ATMA1 - PG-TSDSON-8 FL

ISZ230N10NM6ATMA1

Active
Infineon Technologies

ISZ230N10NM6 OPTIMOS™ 6 100V IN NORMAL LEVEL IS SETTING THE NEW TECHNOLOGY STANDARD IN THE FIELD OF DISCRETE POWER MOSFETS.

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ISZ230N10NM6ATMA1 - PG-TSDSON-8 FL

ISZ230N10NM6ATMA1

Active
Infineon Technologies

ISZ230N10NM6 OPTIMOS™ 6 100V IN NORMAL LEVEL IS SETTING THE NEW TECHNOLOGY STANDARD IN THE FIELD OF DISCRETE POWER MOSFETS.

Technical Specifications

Parameters and characteristics for this part

SpecificationISZ230N10NM6ATMA1
Current - Continuous Drain (Id) @ 25°C7.7 A, 31 A
Drain to Source Voltage (Vdss)100 V
Drive Voltage (Max Rds On, Min Rds On)8 V, 10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs9.3 nC
Input Capacitance (Ciss) (Max) @ Vds690 pF
Mounting TypeSurface Mount
Operating Temperature [Max]175 ░C
Operating Temperature [Min]-55 °C
Package / Case8-PowerTDFN
Rds On (Max) @ Id, Vgs23 mOhm
Supplier Device PackagePG-TSDSON-8 FL
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id3.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.50
10$ 0.99
100$ 0.70
500$ 0.56
1000$ 0.51
Digi-Reel® 1$ 1.50
10$ 0.99
100$ 0.70
500$ 0.56
1000$ 0.51
Tape & Reel (TR) 5000$ 0.42
10000$ 0.41
NewarkEach (Supplied on Full Reel) 5000$ 0.44
10000$ 0.44

Description

General part information

ISZ230 Series

ISZ230N10NM6OptiMOS™ 6 100 Vin normal level is setting the new technology standard in the field of discrete power MOSFETs. Infineon’s latest OptiMOS™ 6 MOSFET technology at 100 V utilizes a proprietary trench technology that enables higher power density, efficiency and ruggedness. Compared to alternative products, Infineon’s leading thin wafer technology is enabling significant performance benefits. Infineon’sOptiMOS™ 6 industrial power MOSFET 100 Vis designed for high switching frequency application such astelecomandserver power supply, but also the ideal choice for other applications such assolar,power toolsanddrones. In PQFN 3.3x3.3 package it achieves ~20% improvements in on-state resistance (RDS(on)) and 30% better figure of merits (FOM - RDS(on)x Qgand Qgd) compared to the previous technology OptiMOS™ 5. This enables designers to increase efficiency, allowing easier thermal design and less paralleling, leading to system cost reduction.