280-5205-01

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IC & COMPONENT SOCKET, 80 CONTACTS, QFN TEST SOCKET, 0.5 MM, 280 SERIES, BERYLLIUM COPPER

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IC & COMPONENT SOCKET, 80 CONTACTS, QFN TEST SOCKET, 0.5 MM, 280 SERIES, BERYLLIUM COPPER

Technical Specifications

Parameters and characteristics for this part

Specification	280-5205-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Features	Open Frame
Housing Material	Polyethersulfone (PES)
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	4 x 20
Number of Positions or Pins (Grid) [custom]	80
Pitch - Mating	0.02 in
Pitch - Mating	0.5 mm
Pitch - Post	0.02 in
Pitch - Post	0.5 mm
Termination	Solder
Termination Post Length [x]	2.9 mm
Termination Post Length [x]	0.114 in
Type	QFN

IC & COMPONENT SOCKET, 80 CONTACTS, QFN TEST SOCKET, 0.5 MM, 280 SERIES, BERYLLIUM COPPER

Part	Mounting Type	Contact Resistance	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Termination	Features	Contact Material - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length [x]	Termination Post Length [x]	Contact Material - Post	Type	Housing Material
3M 280-5205-01	Through Hole	25 mOhm	Gold	0.02 in	0.5 mm	0.02 in	0.5 mm	Gold	Solder	Open Frame	Beryllium Copper	4 x 20	80	2.9 mm	0.114 in	Beryllium Copper	QFN	Polyethersulfone (PES)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

80 (4 x 20) Pos QFN Socket Gold Through Hole

Technical documentation and resources