STM32F765NIH6
ActiveHIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M7 MCU WITH 2 MBYTES OF FLASH MEMORY, 216 MHZ CPU, ART ACCELERATOR, L1 CACHE, SDRAM, DFSDM
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STM32F765NIH6
ActiveHIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M7 MCU WITH 2 MBYTES OF FLASH MEMORY, 216 MHZ CPU, ART ACCELERATOR, L1 CACHE, SDRAM, DFSDM
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Technical Specifications
Parameters and characteristics for this part
| Specification | STM32F765NIH6 |
|---|---|
| Connectivity | QSPI, MMC/SD/SDIO, SAI, EBI/EMI, CANbus, SPDIF, I2C, Ethernet, USB OTG, SPI, UART/USART, LINbus, IrDA |
| Core Processor | ARM® Cortex®-M7 |
| Core Size | 32-Bit Single-Core |
| Data Converters | A/D 24x12b, D/A 2x12b |
| Mounting Type | Surface Mount |
| Number of I/O | 168 I/O |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 216-TFBGA |
| Peripherals | Brown-out Detect/Reset, DMA, POR, WDT, PWM, I2S |
| Program Memory Size | 2 MB |
| Program Memory Type | FLASH |
| RAM Size | 512 K |
| Speed | 216 MHz |
| Supplier Device Package | 216-TFBGA (13x13) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.7 V |
Pricing
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Description
General part information
STM32F765ZG Series
The STM32F765xx, STM32F767xx, STM32F768Ax, and STM32F769xx devices are based on the high-performance Arm®Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a floating point unit (FPU), which supports Arm®double-precision and single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU), which enhances the application security.
The STM32F765xx, STM32F767xx, STM32F768Ax, and STM32F769xx devices incorporate high-speed embedded memories with a flash up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix, and a multi layer AXI interconnect supporting internal and external memories access.
The devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces:
Documents
Technical documentation and resources