48-6572-16
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
48-6572-16
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 48-6572-16 | 
|---|---|
| Contact Finish - Mating | Gold | 
| Contact Finish - Post | Gold | 
| Contact Finish Thickness - Mating | 10 çin | 
| Contact Finish Thickness - Mating | 0.25 çm | 
| Contact Finish Thickness - Post | 10 çin | 
| Contact Finish Thickness - Post | 0.25 çm | 
| Contact Material - Mating | Beryllium Copper | 
| Contact Material - Post | Beryllium Copper | 
| Current Rating (Amps) | 1 A | 
| Features | Closed Frame | 
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | 
| Material Flammability Rating | UL94 V-0 | 
| Mounting Type | Through Hole | 
| Number of Positions or Pins (Grid) | 48 | 
| Pitch - Mating | 0.1 in | 
| Pitch - Mating | 2.54 mm | 
| Pitch - Post | 2.54 mm | 
| Pitch - Post | 0.1 in | 
| Termination | Solder | 
| Termination Post Length | 0.11 in | 
| Termination Post Length | 2.78 mm | 
| Type | 15.24 mm | 
| Type | DIP, ZIF (ZIP) | 
| Type | 0.6 " | 
48-6572 Series
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Current Rating (Amps) | Termination | Mounting Type | Pitch - Post | Pitch - Post | Housing Material | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Contact Material - Mating | Number of Positions or Pins (Grid) | Features | Termination Post Length | Termination Post Length | Contact Finish - Mating | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics  | 10 çin  | 0.25 çm  | UL94 V-0  | 1 A  | Solder  | Through Hole  | 2.54 mm  | 0.1 in  | Polyphenylene Sulfide (PPS)  Glass Filled  | 0.1 in  | 2.54 mm  | Gold  | Beryllium Copper  | 10 çin  | 0.25 çm  | 15.24 mm  | DIP  ZIF (ZIP)  | 0.6 "  | Beryllium Copper  | 48  | Closed Frame  | 0.11 in  | 2.78 mm  | Gold  | 
Aries Electronics  | 10 çin  | 0.25 çm  | UL94 V-0  | 1 A  | Solder  | Through Hole  | 2.54 mm  | 0.1 in  | Polyphenylene Sulfide (PPS)  Glass Filled  | 0.1 in  | 2.54 mm  | Gold  | Beryllium Copper  | 10 çin  | 0.25 çm  | 15.24 mm  | DIP  ZIF (ZIP)  | 0.6 "  | Beryllium Copper  | 48  | Closed Frame  | 0.11 in  | 2.78 mm  | Gold  | 
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 6 | $ 85.95 | |
Description
General part information
48-6572 Series
48 (2 x 24) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources