68-PLS11033-12

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Aries Electronics

CONN SOCKET PGA ZIF GOLD

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Aries Electronics

CONN SOCKET PGA ZIF GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	68-PLS11033-12

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-65 ░C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	ZIF (ZIP), PGA

CONN SOCKET PGA ZIF GOLD

Part	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Mating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Pitch - Post	Pitch - Post	Contact Finish - Mating	Termination	Contact Finish - Post
Aries Electronics 68-PLS11033-12	125 °C	-65 ░C	Beryllium Copper	Through Hole	200 µin	5.08 µm	1 A	0.1 in	2.54 mm	UL94 V-0	3.18 mm	0.125 in	Beryllium Copper	Closed Frame	30 Áin	0.76 Ám	PGA, ZIF (ZIP)	2.54 mm	0.1 in	Gold	Solder	Tin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	6	$ 74.16

General part information

Pos PGA, ZIF (ZIP) Socket Gold Through Hole

Technical documentation and resources