MC68302RC16C

Obsolete

NXP USA Inc.

IC MPU M683XX 16MHZ 132PGA

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DocumentsMC68302 Product Brief MC68302 Series +1

MC68302RC16C

Obsolete

NXP USA Inc.

IC MPU M683XX 16MHZ 132PGA

Deep-Dive with AI

DocumentsMC68302 Product Brief MC68302 Series +1

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	2	$ 162.94

Description

General part information

MC683 Series

M68000 Microprocessor IC M683xx 1 Core, 8/16-Bit 16MHz 132-PGA (34.5x34.5)

Documents

Technical documentation and resources

MC68302 Product Brief

Datasheet

MC68302 Series

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	MC68302RC16C	MC683 Series

Additional Interfaces	GCI, ISDN, NMSI, SCPI, IDL, PCM	DUART, SMC, SCC, SPI, USART, GCI, ISDN, NMSI, SCPI, IDL, PCM
Co-Processors/DSP	RISC CPM, Communications	CPM, Communications, RISC CPM
Core Processor	M68000	EC000, CPU32+, CPU32, M68000
Ethernet	-	10 Mbps
Graphics Acceleration	False	False
Mounting Type	Through Hole	Surface Mount, Through Hole
Number of Cores/Bus Width	-	1 - 32 Bit
Number of Cores/Bus Width [custom]	1	1
Number of Cores/Bus Width [Max] [custom]	16 Bit	16 Bit
Number of Cores/Bus Width [Min] [custom]	8 Bit	8 Bit
Operating Temperature [Max]	70 °C	70 - 85 °C
Operating Temperature [Min]	0 °C	-40 - 0 °C
Package / Case	132-BPGA Exposed Pad	132-BQFP Bumpered, 357-BBGA, 144-BQFP, 144-LQFP, 357-BGA, 240-BFQFP, 132-BPGA Exposed Pad, 241-BEPGA
RAM Controllers	DRAM	DRAM
Speed	16 MHz	16 - 33 MHz
Supplier Device Package	132-PGA	132-PQFP, 357-PBGA (25x25), 144-QFP (28x28), 144-LQFP (20x20), 132-PQFP (46x46), 240-FQFP (32x32), 132-PGA, 241-PGA
Supplier Device Package [x]	34.5	24.13 - 47.24
Supplier Device Package [y]	34.5	24.13 - 47.24
Voltage - I/O	5 V	3.3 - 5 V

MC683 Series

IC MPU M683XX 16MHZ 132PQFP

Part	Core Processor	Supplier Device Package [x]	Supplier Device Package [y]	Supplier Device Package	Additional Interfaces	Operating Temperature [Max]	Operating Temperature [Min]	Number of Cores/Bus Width	Voltage - I/O	RAM Controllers	Mounting Type	Package / Case	Speed	Co-Processors/DSP	Ethernet	Number of Cores/Bus Width [Min] [custom]	Number of Cores/Bus Width [custom]	Number of Cores/Bus Width [Max] [custom]
NXP USA Inc. MC68306EH16BR2	EC000	24.13	24.13	132-PQFP	DUART	70 °C	0 °C	1 Core, 32 Bit	5 V	DRAM	Surface Mount	132-BQFP Bumpered	16 MHz
NXP USA Inc. MC68360VR25VL	CPU32+			357-PBGA (25x25)	SCC, SMC, SPI	70 °C	0 °C	1 Core, 32 Bit	3.3 V	DRAM	Surface Mount	357-BBGA	25 MHz	Communications, CPM	10 Mbps
NXP USA Inc. MC68340CAB16E	CPU32			144-QFP (28x28)	USART	85 °C	-40 °C	1 Core, 32 Bit	5 V	DRAM	Surface Mount	144-BQFP	16 MHz
NXP USA Inc. MC68302PV33C	M68000			144-LQFP (20x20)	GCI, IDL, ISDN, NMSI, PCM, SCPI	70 °C	0 °C		5 V	DRAM	Surface Mount	144-LQFP	33 MHz	Communications, RISC CPM		8 Bit	1	16 Bit
NXP USA Inc. MC68302PV20C	M68000			144-LQFP (20x20)	GCI, IDL, ISDN, NMSI, PCM, SCPI	70 °C	0 °C		5 V	DRAM	Surface Mount	144-LQFP	20 MHz	Communications, RISC CPM		8 Bit	1	16 Bit
NXP USA Inc. MC68340FT25E	CPU32			144-QFP (28x28)	USART	70 °C	0 °C	1 Core, 32 Bit	5 V	DRAM	Surface Mount	144-BQFP	25 MHz
NXP USA Inc. MC68340AB16E	CPU32			144-QFP (28x28)	USART	70 °C	0 °C	1 Core, 32 Bit	5 V	DRAM	Surface Mount	144-BQFP	16 MHz
NXP USA Inc. MC68302AG16C	M68000			144-LQFP (20x20)	GCI, IDL, ISDN, NMSI, PCM, SCPI	70 °C	0 °C		5 V	DRAM	Surface Mount	144-LQFP	16 MHz	Communications, RISC CPM		8 Bit	1	16 Bit
NXP USA Inc. MC68340CAB25E	CPU32			144-QFP (28x28)	USART	85 °C	-40 °C	1 Core, 32 Bit	5 V	DRAM	Surface Mount	144-BQFP	25 MHz
NXP USA Inc. MC68360ZP25VL	CPU32+			357-PBGA (25x25)	SCC, SMC, SPI	70 °C	0 °C	1 Core, 32 Bit	3.3 V	DRAM	Surface Mount	357-BGA	25 MHz	Communications, CPM	10 Mbps