SIP1X20-011BLF
ObsoleteAmphenol ICC (FCI)
CONN SOCKET SIP 20POS GOLD
Deep-Dive with AI
Search across all available documentation for this part.
SIP1X20-011BLF
ObsoleteAmphenol ICC (FCI)
CONN SOCKET SIP 20POS GOLD
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SIP1X20-011BLF |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) [custom] | 20 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 3.18 mm |
| Termination Post Length | 0.125 in |
| Type | SIP |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
SIP1X20-011BLF
20 (1 x 20) Pos SIP Socket Gold Through Hole
Documents
Technical documentation and resources
No documents available