SPHWHAHDND27YZV2DB

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Samsung Semiconductor, Inc.

LED COB D GEN2 WARM WHT SQ 3000K

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SPHWHAHDND27YZV2DB

Active

Samsung Semiconductor, Inc.

LED COB D GEN2 WARM WHT SQ 3000K

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	2000	$ 1.18

Description

General part information

SPHWHAHDND27 Series

LED Lighting COBs Engines Modules Chip On Board (COB) COB D Gen2 Plus White, Warm Square

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	SPHWHAHDND27YZV2DB	SPHWHAHDND27 Series

CCT (K)	3000 K	2700 - 4000 K
Color	White, Warm	White, Warm, Cool, Neutral
Configuration	Square	Square
CRI (Color Rendering Index)	90	90
Current - Max [Max]	720 mA	720 - 920 mA
Current - Test	360 mA	360 mA
Height [z]	1.5 mm	1.5 - 1.65 mm
Lens Type	Flat	Flat
Light Emitting Surface (LES) [diameter]	9.8 mm	9.8 mm
Lumens/Watt @ Current - Test	127 lm/W	109 - 154 lm/W
Luminous Flux @ Current/Temperature	1556 lm	1359 - 1868 lm
Temperature - Test	85 °C	85 °C
Type	Chip On Board (COB)	Chip On Board (COB)
Viewing Angle	115 °	115 °
Voltage - Forward (Vf) (Typ)	34 V	33.6 - 34.6 V

SPHWHAHDND27 Series

LED COB LC013D WARM WHT SQ 3000K

Part	Type	Voltage - Forward (Vf) (Typ)	Temperature - Test	Viewing Angle	Current - Test	Lens Type	Height [z]	Luminous Flux @ Current/Temperature	CCT (K)	Configuration	Current - Max [Max]	Lumens/Watt @ Current - Test	Color	CRI (Color Rendering Index)	Light Emitting Surface (LES) [diameter]
Samsung Semiconductor, Inc. SPHWHAHDND27YZV2D1	Chip On Board (COB)	34.6 V	85 °C	115 °	360 mA	Flat	1.5 mm	1494 lm	3000 K	Square	920 mA	120 lm/W	Warm, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZU3DC	Chip On Board (COB)	33.7 V	85 °C	115 °	360 mA	Flat	1.5 mm	1712 lm	3500 K	Square	720 mA	141 lm/W	Warm, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZV2H3	Chip On Board (COB)	34.6 V	85 °C	115 °	360 mA	Flat	1.5 mm	1423 lm	3000 K	Square	920 mA	114 lm/W	Warm, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZU2D1	Chip On Board (COB)	34.6 V	85 °C	115 °	360 mA	Flat	1.5 mm	1547 lm	3500 K	Square	920 mA		Warm, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZW2DB	Chip On Board (COB)	34 V	85 °C	115 °	360 mA	Flat	1.5 mm	1486 lm	2700 K	Square	720 mA	121 lm/W	Warm, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZR3D1	Chip On Board (COB)	34.6 V	85 °C	115 °	360 mA	Flat	1.5 mm	1584 lm		Square	920 mA	127 lm/W	Cool, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZT2DB	Chip On Board (COB)	34 V	85 °C	115 °	360 mA	Flat	1.5 mm	1670 lm	4000 K	Square	720 mA	136 lm/W	Neutral, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZV3DC	Chip On Board (COB)	33.7 V	85 °C	115 °	360 mA	Flat	1.5 mm	1661 lm	3000 K	Square	720 mA	137 lm/W	Warm, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZT3H4	Chip On Board (COB)	34.6 V	85 °C	115 °	360 mA	Flat	1.5 mm	1505 lm	4000 K	Square	920 mA	121 lm/W	Neutral, White	90	9.8 mm
Samsung Semiconductor, Inc. SPHWHAHDND27YZV2D3	Chip On Board (COB)	34 V	85 °C	115 °	360 mA	Flat	1.5 mm	1661 lm	3000 K	Square	920 mA	136 lm/W	Warm, White	90	9.8 mm