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TN2106N3-G - TO-92 / 3

TN2106N3-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 60V, 2.5 OHM

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TN2106N3-G - TO-92 / 3

TN2106N3-G

Active
Microchip Technology

MOSFET, N-CHANNEL ENHANCEMENT-MODE, 60V, 2.5 OHM

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTN2106N3-GTN2106 Series
Current - Continuous Drain (Id) @ 25°C-300 mA
Drain to Source Voltage (Vdss)-60 V
Drive Voltage (Max Rds On, Min Rds On)-4.5 - 10 V
FET Type-N-Channel
Input Capacitance (Ciss) (Max) @ Vds-50 pF
Mounting Type-Through Hole
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-TO-226-3, TO-92-3
Power Dissipation (Max)-740 mW
Rds On (Max) @ Id, Vgs-2.5 Ohm
Supplier Device Package-TO-92-3
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBag 1$ 0.68
25$ 0.56
100$ 0.52
Microchip DirectBAG 1$ 0.68
25$ 0.56
100$ 0.52
1000$ 0.43
5000$ 0.38
10000$ 0.36

TN2106 Series

MOSFET, N-Channel Enhancement-Mode, 60V, 2.5 Ohm

PartTechnologyDrain to Source Voltage (Vdss)Package / CaseVgs (Max)Power Dissipation (Max) [Max]Vgs(th) (Max) @ IdMounting TypeDrive Voltage (Max Rds On, Min Rds On)Input Capacitance (Ciss) (Max) @ VdsSupplier Device PackageFET TypeCurrent - Continuous Drain (Id) @ 25°COperating Temperature [Min]Operating Temperature [Max]Rds On (Max) @ Id, Vgs [Max]
Microchip Technology
TN2106K1-G
Microchip Technology
TN2106N3-G
Microchip Technology
TN2106N3-G
MOSFET (Metal Oxide)
60 V
TO-226-3, TO-92-3
20 V
740 mW
2 V
Through Hole
4.5 V, 10 V
50 pF
TO-92-3
N-Channel
300 mA
-55 °C
150 °C
2.5 Ohm

Description

General part information

TN2106 Series

This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.