W25M512JVEIM
ActiveWinbond Electronics
IC FLASH 512MBIT SPI/QUAD 8WSON
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W25M512JVEIM
ActiveWinbond Electronics
IC FLASH 512MBIT SPI/QUAD 8WSON
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W25M512JVEIM | W25M512 Series |
|---|---|---|
| Access Time | 7 ns | 7 ns |
| Clock Frequency | 104 MHz | 104 MHz |
| Memory Format | FLASH | FLASH |
| Memory Interface | SPI - Quad I/O | SPI, SPI - Quad I/O |
| Memory Organization | 64 M | 64 M |
| Memory Size | 64 MB | 64 MB |
| Memory Type | Non-Volatile | Non-Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad, 24-TBGA, 16-SOIC |
| Package / Case | - | 0.295 in |
| Package / Case | - | 7.5 mm |
| Supplier Device Package | 8-WSON (8x6) | 8-WSON (8x6), 24-TFBGA (6x8), 16-SOIC |
| Technology | FLASH - NOR | FLASH - NOR |
| Voltage - Supply [Max] | 3.6 V | 1.95 - 3.6 V |
| Voltage - Supply [Min] | 2.7 V | 1.7 - 2.7 V |
| Write Cycle Time - Word, Page | 3 ms | 3 - 5 ms |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
W25M512 Series
IC FLASH 512MBIT SPI 8WSON
| Part | Memory Format | Memory Interface | Memory Organization | Memory Size | Operating Temperature [Max] | Operating Temperature [Min] | Memory Type | Supplier Device Package | Technology | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Mounting Type | Package / Case | Package / Case [x] | Package / Case [y] | Access Time | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25M512JVEIQ | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 8-WSON (8x6) | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | ||||
Winbond Electronics W25M512JVCIQ TR | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 24-TFBGA (6x8) | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 24-TBGA | ||||
Winbond Electronics W25M512JVFIQ | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 16-SOIC | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 16-SOIC | 0.295 in | 7.5 mm | ||
Winbond Electronics W25M512JVCIQ | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 24-TFBGA (6x8) | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 24-TBGA | ||||
Winbond Electronics W25M512JVBIQ TR | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 24-TFBGA (6x8) | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 24-TBGA | ||||
Winbond Electronics W25M512JVBIQ | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 24-TFBGA (6x8) | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 24-TBGA | ||||
Winbond Electronics W25M512JWBIQ | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 24-TFBGA (6x8) | FLASH - NOR | 1.7 V | 1.95 V | 104 MHz | Surface Mount | 24-TBGA | 7 ns | 5 ms | ||
Winbond Electronics W25M512JVFIQ TR | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 16-SOIC | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 16-SOIC | 0.295 in | 7.5 mm | ||
Winbond Electronics W25M512JVEIM | FLASH | SPI - Quad I/O | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 8-WSON (8x6) | FLASH - NOR | 2.7 V | 3.6 V | 104 MHz | Surface Mount | 8-WDFN Exposed Pad | 7 ns | 3 ms | ||
Winbond Electronics W25M512JWCIQ | FLASH | SPI | 64 M | 64 MB | 85 °C | -40 °C | Non-Volatile | 24-TFBGA (6x8) | FLASH - NOR | 1.7 V | 1.95 V | 104 MHz | Surface Mount | 24-TBGA | 7 ns | 5 ms |
Description
General part information
W25M512 Series
FLASH - NOR Memory IC 512Mbit SPI - Quad I/O 104 MHz 7 ns 8-WSON (8x6)
Documents
Technical documentation and resources