Specification	HTMS-117-51-S-D-SM

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Length - Mating	0.19 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Per Contact)	5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	34
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.05 in
Row Spacing - Mating	0.1 in
Shrouding	Unshrouded
Style	Board
Termination	Solder

HTMS-117 Series

Part	Insulation Color	Contact Finish - Post	Shrouding	Number of Positions Loaded	Contact Finish Thickness - Mating	Number of Positions	Contact Material	Fastening Type	Contact Finish - Mating	Style	Contact Length - Mating	Current Rating (Per Contact)	Connector Type	Mounting Type	Pitch - Mating	Number of Rows	Contact Type	Insulation Height	Operating Temperature (Max)	Operating Temperature (Min)	Contact Shape	Termination	Material Flammability Rating	Insulation Material	Contact Finish Thickness - Post	Contact Length - Post	Overall Contact Length	Row Spacing - Mating
Samtec Inc. HTMS-103-01-G-S-RA
Samtec Inc. HTMS-103-01-G-S-SM	Black	Gold	Unshrouded	All	10 µin	3	Phosphor Bronze	Push-Pull	Gold	Board	0.23 in	5 A	Header	Surface Mount	0.05 in	1	Male Pin	0.1 in	125 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	3 µin
Samtec Inc. HTMS-103-02-S-D	Black	Tin	Unshrouded	All	30 µin	6	Phosphor Bronze	Push-Pull	Gold	Board	0.1 in	5 A	Header	Through Hole	0.05 in	2	Male Pin	0.1 in	125 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)		0.12 in	0.32 in	0.1 in
Samtec Inc. HTMS-103-56-G-D	Black	Gold	Unshrouded	All	10 µin	6	Phosphor Bronze	Push-Pull	Gold	Board	0.405 in	5 A	Header	Through Hole	0.05 in	2	Male Pin	0.1 in	125 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	3 µin	0.12 in	0.625 in	0.1 in
Samtec Inc. HTMS-103-01-G-D-RA	Black	Gold	Unshrouded	All	10 µin	6	Phosphor Bronze	Push-Pull	Gold	Board	0.23 in	5 A	Header	Right Angle Through Hole	0.05 in	2	Male Pin	0.196 in	125 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	3 µin	0.14 in		0.1 in
Samtec Inc. HTMS-103-02-S-D-SM	Black	Tin	Unshrouded			6	Phosphor Bronze	Push-Pull	Gold	Board			Header	Surface Mount	0.05 in	2	Male Pin		125 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. HTMS-103-53-G-S	Black	Gold	Unshrouded			3	Phosphor Bronze	Push-Pull	Gold	Board			Header	Through Hole	0.05 in	1	Male Pin		125 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)
Samtec Inc. HTMS-103-02-G-S-SM
Samtec Inc. HTMS-103-02-L-S	Black	Tin	Unshrouded	All	10 µin	3	Phosphor Bronze	Push-Pull	Gold	Board	0.1 in	5 A	Header	Through Hole	0.05 in	1	Male Pin	0.1 in	125 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)		0.12 in	0.32 in
Samtec Inc. HTMS-103-03-T-D-SM	Black	Tin	Unshrouded	All		6	Phosphor Bronze	Push-Pull	Tin	Board	0.125 in	5 A	Header	Surface Mount	0.05 in	2	Male Pin	0.1 in	105 °C	-55 °C	Square	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)				0.1 in

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