Specification	514-83-352M26-001148

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	29.5 Ąin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Contact Resistance	10 mOhm
Current Rating	1 A
Features	Open Frame
Grid Columns	26
Grid Rows	26
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	352
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.055 in
Type	BGA

514-83 Series

Part	Termination	Operating Temperature (Max)	Operating Temperature (Min)	Features	Type	Contact Finish - Mating	Contact Finish - Post	Housing Material	Mounting Type	Contact Material - Mating	Pitch - Post	Contact Material - Post	Contact Finish Thickness - Mating	Pitch - Mating	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Contact Resistance	Material Flammability Rating	Current Rating	Termination Post Length
Preci-Dip 514-83-419-19-001154	Solder	125 °C	-55 °C	Open Frame	PGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	19	19	419	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-078-13-061117	Solder	125 °C	-55 °C	Open Frame	PGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	13	13	78	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-478M26-131148	Solder	125 °C	-55 °C	Open Frame	BGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	26	26	478	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-357M19-001148	Solder	125 °C	-55 °C	Open Frame	BGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	19	19	357	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-272M20-001148	Solder	125 °C	-55 °C	Open Frame	BGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	20	20	272	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-432M31-001148	Solder	125 °C	-55 °C	Open Frame	BGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	31	31	432	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-145-15-081117	Solder	125 °C	-55 °C	Open Frame	PGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	15	15	145	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-321-19-121154	Solder	125 °C	-55 °C	Open Frame	PGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	19	19	321	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-504M29-001148	Solder	125 °C	-55 °C	Open Frame	BGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	29	29	504	10 mOhm	UL94 V-0	1 A	0.055 in
Preci-Dip 514-83-456M26-001148	Solder	125 °C	-55 °C	Open Frame	BGA	Gold	Tin	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Surface Mount	Beryllium Copper	0.1 in	Brass	29.5 Ąin	0.1 in	26	26	456	10 mOhm	UL94 V-0	1 A	0.055 in

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