ZSSC3240CI1C
ActiveRenesas Electronics Corporation
WAFER (SAWN) - FRAME
ZSSC3240CI1C
ActiveRenesas Electronics Corporation
WAFER (SAWN) - FRAME
Description
General part information
ZSSC3240CI1C
WAFER (SAWN) - FRAME
Technical Specifications
Parameters and characteristics for this part
| Specification | ZSSC3240CI1C |
|---|---|
| Current - Supply | 2.8 mA |
| Input Type | Analog |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Output Type | SPI, 1-Wire®, I2C |
| Package / Case | Die |
| Package Name | Die |
| Type | Signal Conditioner |
Pricing
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CAD
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Documents
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