Part	Contact Finish Thickness - Mating	Mounting Type	Contact Finish - Post	Material Flammability Rating	Shrouding	Insulation Height	Insulation Material	Contact Finish - Mating	Overall Contact Length	Contact Shape	Connector Type	Current Rating (Per Contact)	Style	Number of Positions Loaded	Termination	Number of Rows	Contact Length - Mating	Number of Positions	Contact Type	Fastening Type	Contact Material	Operating Temperature (Max)	Operating Temperature (Min)	Row Spacing - Mating	Insulation Color	Pitch - Mating	Contact Length - Post	Contact Finish Thickness - Post
Samtec Inc. HTMS-105-02-G-D	10 µin	Through Hole	Gold	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold	0.32 in	Square	Header	5 A	Board	All	Solder	2	0.1 in	10	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C	0.1 in	Black	0.05 in	0.12 in	3 µin
Samtec Inc. HTMS-105-55-S-D	30 µin	Through Hole	Tin	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold	0.61 in	Square	Header	5 A	Board	All	Solder	2	0.39 in	10	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C	0.1 in	Black	0.05 in	0.12 in
Samtec Inc. HTMS-105-54-G-D-SM	10 µin	Surface Mount	Gold	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold		Square	Header	5 A	Board	All	Solder	2	0.335 in	10	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C	0.1 in	Black	0.05 in		3 µin
Samtec Inc. HTMS-105-59-L-S	10 µin	Through Hole	Tin	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold	0.755 in	Square	Header	5 A	Board	All	Solder	1	0.535 in	5	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C		Black	0.05 in	0.12 in
Samtec Inc. HTMS-105-55-G-D	10 µin	Through Hole	Gold	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold	0.61 in	Square	Header	5 A	Board	All	Solder	2	0.39 in	10	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C	0.1 in	Black	0.05 in	0.12 in	3 µin
Samtec Inc. HTMS-105-52-F-S	3 µin	Through Hole	Tin	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold	0.425 in	Square	Header	5 A	Board	All	Solder	1	0.205 in	5	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C		Black	0.05 in	0.12 in
Samtec Inc. HTMS-105-51-L-D	10 µin	Through Hole	Tin	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold	0.41 in	Square	Header	5 A	Board	All	Solder	2	0.19 in	10	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C	0.1 in	Black	0.05 in	0.12 in
Samtec Inc. HTMS-105-51-G-D	10 µin	Through Hole	Gold	UL94 V-0	Unshrouded	0.1 in	Liquid Crystal Polymer (LCP)	Gold	0.41 in	Square	Header	5 A	Board	All	Solder	2	0.19 in	10	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C	0.1 in	Black	0.05 in	0.12 in	3 µin
Samtec Inc. HTMS-105-03-S-D-RA	30 µin	Right Angle Through Hole	Tin	UL94 V-0	Unshrouded	0.196 in	Liquid Crystal Polymer (LCP)	Gold		Square	Header	5 A	Board	All	Solder	2	0.125 in	10	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C	0.1 in	Black	0.05 in	0.14 in
Samtec Inc. HTMS-105-01-G-S-RA	10 µin	Right Angle Through Hole	Gold	UL94 V-0	Unshrouded	0.096 in	Liquid Crystal Polymer (LCP)	Gold		Square	Header	5 A	Board	All	Solder	1	0.23 in	5	Male Pin	Push-Pull	Phosphor Bronze	125 °C	-55 °C		Black	0.05 in	0.14 in	3 µin

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HTMS-113-02-G-D | Datasheet