
SSLFNC-T5-250G
ActiveSRA Soldering Products
SAC 305 LEAD FREE SOLDER PASTE T
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SSLFNC-T5-250G
ActiveSRA Soldering Products
SAC 305 LEAD FREE SOLDER PASTE T
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SSLFNC-T5-250G |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Flux Type | No-Clean |
| Form | Jar, 8.8 oz (250g) |
| Melting Point [Max] [custom] | 428 °F |
| Melting Point [Max] [custom] | 220 °C |
| Melting Point [Min] [custom] | 217 °C |
| Melting Point [Min] [custom] | 422 °F |
| Mesh Type | 5 |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bag | 1 | $ 104.99 | |
Description
General part information
SSLFNC Series
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Documents
Technical documentation and resources