CCBLF227L2062E
ActiveCanfield Technologies
BLF 227 NO CLEAN FLUX 8 OZ .062
CCBLF227L2062E
ActiveCanfield Technologies
BLF 227 NO CLEAN FLUX 8 OZ .062
Description
General part information
CCBLF227L2062E
Lead Free No-Clean Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 14 AWG, 16 SWG Spool, 8 oz (227g), 1/2 lb
Technical Specifications
Parameters and characteristics for this part
| Specification | CCBLF227L2062E |
|---|---|
| Composition | BLF 227 |
| Cu Composition | 0.8 % |
| Diameter | 0.062 in |
| Form | Spool |
| Form Weight | 0.5 lb |
| Melting Point | 440 °F |
| Ni Composition | 0.03 % |
| Process | Lead Free |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 99.17 % |
| Storage/Refrigeration Temperature (Maximum) | 104 °F |
| Storage/Refrigeration Temperature (Minimum) | 50 °F |
| Type | Wire Solder |
| Wire Gauge | 16 SWG, 14 AWG |
Pricing
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